Vertical Interconnect Packaging for Thermal Performance and Thick Dies
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Solution Overview
Problem
Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and relatively low performance with large package sizes.
Innovation Solution
The use of tall and narrow vertical interconnect structures between upper and lower substrates, incorporating conductive bodies such as copper core balls and wires, to support thick-cavity interposers, which enhance thermal performance and enable increased die thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional electronic packages are used, then manufacturing cost is reduced, but thermal performance deteriorates and package size increases
Solution Approach 1:
The patent transitions from planar interconnect layouts to three-dimensional vertical interconnect structures. Tall and narrow vertical interconnects extend in the vertical dimension, enabling heat dissipation pathways perpendicular to the substrate plane while maintaining a compact footprint, thus improving thermal performance without increasing package size.
Solution Approach 2:
The patent implements nested interconnect structures where conductive bodies are positioned within cavities of the interposer. This nesting arrangement allows multiple interconnect levels to occupy overlapping spatial volumes, increasing interconnect density and thermal conduction pathways while maintaining a compact package size.
2Reliability
If conventional interconnect structures are used, then manufacturing simplicity is maintained, but reliability decreases
Solution Approach 1:
The patent divides the interconnect structure into separate functional segments: tall vertical interconnects for signal transmission, conductive bodies for electrical connection, and cavity structures for mechanical support and thermal management. This segmentation allows each component to be optimized independently for its specific function, improving overall reliability while managing complexity through modular design.
Solution Approach 2:
The patent introduces an interposer as an intermediary substrate between upper and lower substrates. This interposer contains cavities that house conductive bodies and provides a platform for vertical interconnects, mediating the complex interconnections between substrates and improving reliability by isolating and protecting critical interconnect elements.
3Productivity
If die thickness is increased, then performance is improved, but package size increases
Solution Approach 1:
The patent utilizes the vertical dimension through tall interconnects extending perpendicular to the substrate plane. This vertical arrangement allows thicker dies to be connected without increasing the lateral footprint of the package, as the additional thickness is accommodated in the vertical direction where space is more efficiently utilized.
Solution Approach 2:
The patent employs asymmetric cavity structures within the interposer, with cavities positioned and sized to accommodate specific interconnect requirements. This asymmetric design allows optimized space utilization for vertical interconnects and conductive bodies, enabling thicker dies to be integrated without proportionally increasing overall package volume.
Data Source
AI summary
In one example, an electronic device includes a first substrate and an electronic component coupled to an inner side of the first substrate. A vertical interconnect structure can be coupled to the inner side of the first substrate and may include a core structure coupled to the first substrate, a wire coupled to the core structure and opposite the first substrate, and an encapsulant disposed around the wire. The device also includes a second substrate disposed over the electronic component and coupled to the vertical interconnect structure. The encapsulant can comprise protrusions and a recessed side that define a cavity. The wire can protrude from the encapsulant into the cavity.