Vertical Interconnects for IC Packaging Thickness Reduction
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in achieving miniaturization, increased density, and cost reduction while maintaining reliability, as they are limited by large interconnection pitches and solder ball diameters, which hinder size and thickness reduction and lead to warpage issues.
Innovation Solution
The implementation of vertical interconnects with specific heights equal to the combination of integrated circuit and connector heights, directly attached to substrates, eliminates the need for wire bonding and reduces manufacturing processes, allowing for a thinner, more compact package structure with improved reliability by distributing forces evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional wire bonding and solder ball interconnection methods are used, then electrical connections can be established, but the package size and thickness cannot be reduced further due to large interconnection pitches
Solution Approach 1:
The patent transitions from planar interconnection (solder balls on substrate surface) to vertical interconnection (through-substrate vias with conductive posts). This dimensional change allows interconnects to pass through the substrate thickness rather than occupying lateral space, enabling package thinning while maintaining electrical connection functionality.
Solution Approach 2:
The invention changes the interconnection geometry parameters from large-diameter solder balls with wide pitch to thin conductive posts with small diameter and tight pitch. This parameter transformation enables reduced interconnection pitch and package thickness while improving electrical performance and reliability.
2Productivity
If more integrated circuits are integrated into a single package to increase density, then functionality is improved, but the package structure becomes more complex and manufacturing difficulty increases
Solution Approach 1:
The patent divides the package into distinct functional layers: substrate, vertical interconnects, integrated circuits, and encapsulation. This segmentation allows each component to be optimized independently and simplifies the assembly process, enabling high-density integration without proportionally increasing manufacturing complexity.
Solution Approach 2:
The vertical interconnect structure serves multiple functions simultaneously: providing electrical connections, reducing package thickness, enabling heat dissipation pathways, and supporting multiple integrated circuits. This multi-functionality increases packaging density without adding proportional structural complexity.
3Strength
If conventional packaging methods are used, then manufacturing processes are established, but warpage issues occur and structural integrity is compromised
Solution Approach 1:
The conductive posts and vias are formed in the substrate before mounting the integrated circuits. This preliminary structuring establishes a rigid framework that prevents warpage during subsequent assembly processes, maintaining structural integrity while enabling standardized manufacturing procedures.
Solution Approach 2:
The substrate combines multiple materials with complementary properties: electrically conductive materials for signal transmission, mechanically strong materials for structural support, and thermally conductive materials for heat dissipation. This composite construction enhances overall structural integrity without complicating the manufacturing process.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; attaching vertical interconnects along a periphery of the first substrate; mounting an integrated circuit over the first substrate, the integrated circuit surrounded by the vertical interconnects; and mounting a second substrate directly on the vertical interconnects and the integrated circuit.