Vertical Interposer Board for Server Space Optimization
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Solution Overview
Problem
The limited space within servers hinders the effective extension and enhancement of network capabilities, as existing solutions for improving hard disk access speed and stability are insufficient to meet growing operational demands.
Innovation Solution
The introduction of a vertical interposer board that electrically couples multiple electronic modules and power supply units via a mid-plane board, allowing for parallel mounting and efficient use of space within the server chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to increase hard disk access speed and stability, then operational requirements for networking can be met, but the space limitation inside the server prevents sufficient extension of electronic devices
Solution Approach 1:
The patent introduces a vertical interposer board that extends in the vertical dimension (upward from the bottom portion) rather than only in the horizontal plane. This allows electronic devices to be mounted above the existing chassis structure, effectively utilizing three-dimensional space to overcome the limited internal area constraint while maintaining reliable hard disk access speeds.
Solution Approach 2:
The vertical interposer board serves as an intermediary component that electrically couples the first electronic module (with first storage units) and the second electronic module (with second storage units) to the mid-plane board. This mediator enables signal and power transmission between modules without requiring additional horizontal space, resolving the contradiction between device extension and space limitation.
2Productivity
If more electronic devices are added to meet network requirements, then server capacity and processing speed are enhanced, but the limited space inside the server makes implementation difficult
Solution Approach 1:
The patent divides the server's electronic device architecture into segmented modules: a first electronic module with first storage units, a second electronic module with second storage units, and a vertical interposer board. This segmentation allows each module to be independently designed, manufactured, and installed, making the addition of electronic devices easier and more flexible while maintaining high server capacity and processing speed.
Solution Approach 2:
By utilizing the vertical dimension through the interposer board extending upward from the bottom portion, the patent enables the installation of additional electronic devices without compromising the ease of operation. The vertical arrangement provides clear installation pathways and maintains access to existing components while adding new functionality.
3Adaptability or versatility
If functional boards are added to enhance server capabilities, then network requirements in mass data management are met, but the small space inside the server prevents sufficient extension
Solution Approach 1:
The patent resolves the volume constraint by transitioning from two-dimensional horizontal arrangement to three-dimensional vertical arrangement. The vertical interposer board extends upward from the bottom portion of the chassis, creating additional mounting volume above the existing structure. This enables the server to accommodate functional boards for mass data management without increasing the horizontal footprint, thereby maintaining adaptability and versatility.
Solution Approach 2:
The vertical interposer board is nested within the existing server chassis structure, specifically extending from the bottom portion upward. This nesting approach allows the interposer board and associated electronic modules to be integrated into the server's existing volume without requiring external expansion, effectively utilizing the available three-dimensional space to enhance server capabilities.
Data Source
AI summary
A server includes a mid-plane board, a storage backplane module, a plurality of first storage units, a vertical interposer board, a first electronic module, a second electronic module and a plurality of power supply units. The vertical interposer board is vertically inserted and thus electrically coupled to the mid-plane board. The storage backplane module, the vertical interposer board, the first electronic module, the second electronic module and the power supply units are electrically connected to each other through the mid-plane board.