Vertical Half-Bridge Inverter Layout for Heat Dissipation
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Solution Overview
Problem
Multiphase inverter circuits face challenges in heat dissipation and size reduction, which are essential for practical applications, especially when driving electric motors.
Innovation Solution
The design incorporates an insulating substrate with conductive redistribution structures and packaged low side and high side switches arranged vertically between phase output leads and the substrate, allowing for efficient heat dissipation and compact layout by parallel coupling of switches and phase output leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If switches are arranged laterally on the substrate, then electrical connections are simplified, but lateral space increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent transitions from a two-dimensional lateral arrangement of switches to a three-dimensional vertical arrangement. Switches are positioned above and below the substrate plane, with phase output leads extending vertically to connect to switches on opposite sides. This dimensional change reduces lateral footprint while increasing heat dissipation surface area through vertical orientation.
2Area of stationary object
If switches are arranged vertically between phase output leads and substrate, then heat dissipation improves and lateral space reduces, but electrical connection complexity increases
Solution Approach 1:
The patent uses vertical positioning of switches above and below the substrate to reduce lateral space. Phase output leads extend vertically to connect to switches on opposite sides of the substrate, creating a three-dimensional connection architecture that achieves compactness while managing electrical connections through spatial separation.
3Power
If multiple switches are parallel coupled, then current carrying capacity increases, but device complexity and space requirements increase
Solution Approach 1:
The patent combines multiple switches (low side and high side switches) into integrated half-bridge circuits. These half-bridge circuits are then parallel-coupled to achieve the desired current carrying capacity. The merging of switches into functional blocks simplifies the overall device architecture while maintaining high power capability through parallel operation of the integrated units.
Data Source
AI summary
A multiphase inverter apparatus includes: an insulating substrate; at least one low voltage bus and at least one high voltage bus on a first surface of the insulating substrate; a plurality of half-bridge circuits, each half-bridge circuit being electrically coupled between a respective one of the at least one low voltage bus and a respective one of the at least one high voltage bus; and a phase output lead for each half-bridge circuit. For each half bridge circuit, the phase output lead is arranged on and electrically coupled to at least one packaged low side switch and at least one packaged high side switch of the half bridge circuit such that each packaged low side switch and each packaged high side switch is arranged vertically between the phase output lead and the first surface of the insulating substrate.