Vertical Laser Oscillator Layout for Compact Substrate Processing

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Solution Overview

Problem

Conventional substrate processing apparatuses for laser processing are oversized due to the horizontal extension of the laser oscillator, leading to increased footprint and height, which limits the number of units that can be installed and complicates maintenance, especially due to the high placement of the heavy laser oscillator.

Innovation Solution

The substrate processing apparatus is designed with the laser oscillator extending in the height direction, allowing for a smaller footprint and reduced height, while the optical system is configured to adjust and direct the laser light horizontally, enabling efficient downsizing and improved maintenance access.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the laser oscillator is disposed horizontally above the processing head, then the laser light can be effectively directed to the substrate, but the apparatus occupies a large horizontal area and has increased height

Engineering Contradiction:
Improvelaser light direction controlVSAvoidapparatus footprint
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent changes the orientation of the laser oscillator from horizontal to vertical arrangement. The laser oscillator is now disposed below the processing head, extending in the height direction rather than the horizontal direction. This dimensional reorientation allows the same functional capability (laser light direction control) to be achieved while dramatically reducing the horizontal footprint of the apparatus.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the laser oscillator is disposed horizontally above the processing head, then the laser processing function is achieved, but the apparatus height increases and maintenance becomes complicated

Engineering Contradiction:
Improvelaser processing functionVSAvoidmaintenance accessibility
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent inverts the conventional arrangement by placing the laser oscillator below the processing head instead of above it. This inversion maintains the laser processing function while improving maintenance accessibility, as the laser oscillator is now positioned at a lower, more accessible location that does not require complex overhead support structures.

Inventive Principle:
Principle #13The other way round (Inversion)

3Reliability

If the laser oscillator extends in the horizontal direction, then the laser beam path is established, but the apparatus becomes oversized and limits the number of units that can be installed

Engineering Contradiction:
Improvelaser beam pathVSAvoidnumber of installable units
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent reorients the laser oscillator to extend in the height direction rather than the horizontal direction. This allows the laser beam path to be established vertically through the processing head to the substrate, while the horizontal space required is minimized. This enables multiple apparatus units to be installed in closer proximity, increasing overall system productivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for a more compact apparatus that can process more substrates and simplifies maintenance by reducing the height and footprint, enabling more units to be installed and improving operational efficiency and precision.

Implementation Method 1

a mirror configured to change, above the substrate holder, a direction of the laser light emitted from the laser oscillator into a horizontal direction

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

a laser radiation lens configured to radiate the laser light to the substrate held by the substrate holder

Methodology Applied
Scientific EffectLens focusing: Lens

Data Source

PatentUS20240162061A1Substrate processing apparatus, substrate processing system, and substrate processing method
Publication Date: 2024.05.16 TOKYO ELECTRON LTD
  • US20240162061A1 patent drawing
  • US20240162061A1 patent drawing
  • US20240162061A1 patent drawing

AI summary

A substrate processing apparatus configured to process a substrate by radiating laser light to the substrate includes a substrate holder configured to hold the substrate; a laser radiation lens configured to radiate the laser light to the substrate held by the substrate holder; a laser oscillator configured to emit the laser light toward a space above a substrate holding surface of the substrate holder; a mirror configured to change, above the substrate holder, a direction of the laser light emitted from the laser oscillator into a horizontal direction; and an optical system configured to adjust an output of the laser light incident from the mirror, and guide the laser light to the laser radiation lens.