Vertical LED Die Packaging With Laser-Formed Conductive Ditches
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Solution Overview
Problem
The miniaturization of LED die size complicates the packaging process, particularly the wire bonding procedure, leading to reduced packaging yield and reliability issues.
Innovation Solution
A vertical LED die packaging method that forms nano silver wire ditches using a laser process to replace external wire bonding, involving substrate drilling, metal coating, laser dissolution of transparent glue to create ditches, and filling with conductive liquid, followed by encapsulation with insulating glue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the LED die size is miniaturized to improve integration density and reduce packaging structure size, then the packaging yield decreases and wire bonding becomes difficult to perform
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a laser-based material removal process. Instead of using mechanical wires and bonding tools to connect miniaturized LED dies, the invention uses laser beams to selectively remove transparent glue and form conductive ditches, which are then filled with conductive material to create electrical connections. This substitution eliminates the difficulty of performing wire bonding on miniaturized components while maintaining connection reliability.
Solution Approach 2:
The patent changes the physical state and properties of materials during the connection process. By using laser energy to locally melt and evaporate transparent glue, the process transitions from a mechanical bonding approach to a thermal material removal approach. The conductive liquid is then applied in liquid form and solidifies to form conductive bridges, utilizing phase changes to achieve reliable electrical connections in miniaturized structures.
2Ease of manufacture
If conventional wire bonding process is used on miniaturized LED dies, then the manufacturing complexity increases and process difficulty rises
Solution Approach 1:
The patent replaces the complex mechanical wire bonding system with a simpler laser-based system. The laser process involves directing energy beams to remove material and form ditches, followed by applying conductive liquid. This eliminates the need for precise mechanical positioning, wire feeding, and bonding force control required in conventional wire bonding, significantly simplifying the manufacturing process for miniaturized LED dies.
3Volume of moving object
If the LED die size is reduced to improve integration density, then the heat dissipation efficiency decreases
Solution Approach 1:
The patent segments the heat dissipation function by creating separate thermal management pathways. The conductive ditches filled with conductive material serve dual purposes: electrical connection and heat conduction. By separating the electrical interconnection function from the mechanical wire bonding function, the design allows dedicated thermal pathways to be established through the substrate, improving heat dissipation efficiency even as LED die size decreases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively replaces conventional wire bonding, optimizes packaging yield, and achieves miniaturized packaging structure while enhancing reliability and stability of LED dies.
Implementation Method 1
a laser process is performed to dissolve the transparent glue such that a plurality of ditch is formed
Data Source
AI summary
A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a second metal material, and a transparent glue is used to cover thereon. A laser process is then employed to dissolve the transparent glue for forming ditches. And, a conductive liquid is applied to fill the ditches and an insulating glue is provided to embrace and encapsulate the vertical light emitting diode dies. By employing the packaging method of the present invention, the current external wire bonding process can be effectively replaced, thereby die size miniaturization as well as packaging yield of the vertical light emitting diode dies are believed to be optimized.