Vertical LED Lighting Device with Reflective Recesses
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Solution Overview
Problem
Conventional LED lighting devices face challenges in achieving high power and luminous efficiency while maintaining a long lifespan and efficient heat dissipation, often requiring high current and complex manufacturing processes.
Innovation Solution
The LED lighting device incorporates a substrate with reflective recesses and protrusions, isolation layers, and vertically stacked LEDs connected in series through conductive bonding and transparent sealing materials, allowing for high voltage operation with reduced current requirements and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high current is used to achieve high power and brightness, then luminous efficiency is improved, but heat generation increases and lifespan decreases
Solution Approach 1:
The patent transitions from conventional horizontal LED mounting to vertical mounting configuration. Multiple LEDs are arranged vertically stacked on the substrate, with current flowing through each LED in series from bottom to top. This dimensional change allows for better heat dissipation along the vertical axis while maintaining high power output, as heat can escape more efficiently from the vertical structure compared to horizontal arrangement.
Solution Approach 2:
The patent divides the lighting device into multiple separate LED components mounted vertically on the substrate. Each LED is individually positioned in recesses and connected through conductive bonding layers, allowing the current to be segmented and distributed through multiple LED elements in series. This segmentation reduces the current burden on any single LED while achieving high total power output.
2Reliability
If conventional wire bonding is used for LED connection, then electrical connectivity is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the electrical connection function with the mechanical mounting structure. Conductive bonding layers are integrated directly into the substrate design, eliminating the need for separate wire bonding processes. The substrate itself serves as both the mechanical support and the electrical interconnection medium, with conductive pathways built into the substrate structure to connect LED anodes and cathodes directly.
Solution Approach 2:
The patent replaces the mechanical wire bonding process with a direct conductive bonding approach. Instead of using separate metal wires to connect LEDs, the substrate incorporates integrated conductive pathways that provide both mechanical support and electrical connection. This substitution eliminates the complex wire bonding step and reduces manufacturing complexity.
3Ease of manufacture
If LEDs are mounted flush with substrate surface, then manufacturing is simplified, but light extraction efficiency decreases
Solution Approach 1:
The patent introduces protruding portions on the substrate surface that create curved or domed mounting surfaces for the LEDs. These protrusions elevate the LEDs above the flat substrate plane, creating a curved interface that improves light extraction efficiency through increased light-path length and reduced total internal reflection. The curved surface of the protrusions helps redirect light more effectively into the surrounding medium.
Solution Approach 2:
The patent uses vertical protrusions on the substrate to create height variation, positioning LEDs at different elevations. This dimensional change from a flat 2D mounting surface to a 3D structured surface with protrusions allows LEDs to be mounted in recesses of the protrusions, optimizing both light extraction and thermal management while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances power and luminous efficiency, extends LED lifespan by reducing heat and current stress, and simplifies manufacturing by eliminating the need for wire bonding, thereby improving yield and reducing costs.
Implementation Method 1
The recess has a bottom surface and at least one sidewall adjacent to the bottom surface. The bottom surface and the sidewall are reflective.
Implementation Method 2
The conductive bonding layer bonds the vertical LED onto the bottom electrode.
Implementation Method 3
The transparent sealing material is disposed in the recess. The transparent sealing material has at least one opening therein to expose at least a part of the vertical LED.
Data Source
AI summary
A light-emitting diode (LED) lighting device includes a substrate, an isolation layer, a first bottom electrode, a second bottom electrode, at least one first vertical LED, a first conductive bonding layer, at least one second vertical LED, a second conductive bonding layer, a first transparent sealing material, a second transparent sealing material, and a top electrode. The substrate has a base portion and a plurality of protruding portions present on the base portion. The base portion and the protruding portions cooperate to define at least one first recess and at least one second recess. At least one of the first recess and the second recess has a bottom surface and at least one sidewall adjacent to the bottom surface. The bottom surface and the sidewall are reflective. The first vertical LED and the second vertical LED are electrically connected in series.