Vertical LED Pixel Structure for High Resolution Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The development of ultra-small LED elements for display devices is limited by their horizontal arrangement, which restricts the achievement of high resolution due to space constraints.
Innovation Solution
A pixel design featuring a substrate with a first and second electrode, a partition wall insulation layer, and a light emitting element vertically arranged between the electrodes, allowing for efficient connection and reduced spatial requirements, enabling higher pixel density and resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ultra-small LED elements are horizontally arranged, then the display device can be manufactured with current technology, but the resolution is limited due to space constraints
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical arrangement of ultra-small LED elements. The LED elements are positioned upright on the substrate with their long axes extending perpendicular to the substrate surface, utilizing the vertical dimension to reduce horizontal space requirements and increase pixel density for higher resolution displays.
2Manufacturing precision
If the number of pixels per unit area is increased, then the resolution is enhanced, but the space for arranging each pixel is reduced
Solution Approach 1:
By arranging LED elements vertically rather than horizontally, the patent enables higher pixel density within the same planar area. The vertical orientation allows pixels to be packed more closely in the horizontal plane while maintaining sufficient space for electrical connections and light emission.
Solution Approach 2:
The patent employs a multi-layer structure where LED elements are positioned on side surfaces of partition walls, with electrical connections extending through multiple layers. This nested arrangement allows efficient use of three-dimensional space, enabling higher pixel density without increasing the overall footprint of each pixel.
3Manufacturing precision
If vertical arrangement of light emitting elements is implemented, then pixel density and resolution are increased, but the electrode connection structure becomes more complex
Solution Approach 1:
The patent divides the electrode structure into multiple segments including first electrodes on the substrate, second electrodes on partition wall insulation layers, and branch parts extending to connect with vertically arranged LED elements. This segmented approach simplifies the connection process by creating modular electrical pathways that can be manufactured using standard photolithography and patterning techniques.
Solution Approach 2:
The patent introduces partition wall insulation layers as intermediary structures that facilitate electrical connections between the substrate electrodes and the vertically arranged LED elements. These insulation layers with integrated electrodes act as mediators, simplifying the overall connection architecture by providing dedicated pathways for electrical signals to reach the LED elements without requiring complex direct routing.
Data Source
AI summary
Provided is a pixel. The pixel includes a substrate, a first electrode disposed on the substrate, a partition wall insulation layer disposed on the substrate to cover a first portion of the first electrode, a second electrode disposed on the partition wall insulation layer and including a second portion overlapping the first portion, and a light emitting element disposed on a first side surface of the partition wall insulation layer between the first portion and the second portion and connected to the first electrode and the second electrode.