Vertical LED Protective Electrode for Clean Wire Bonding
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Solution Overview
Problem
Conventional vertical-type light-emitting diodes face contamination issues due to direct contact between the pad electrode and blue film during the packaging process, leading to surface dirt and increased risks in subsequent wiring, which compromises the quality of the chips.
Innovation Solution
A protruding protective electrode is introduced, positioned higher than the second electrode, creating a height difference that minimizes contact with the blue film, thereby reducing contamination and ensuring cleaner surfaces for wire bonding, ensuring optoelectronic quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the pad electrode is positioned at the highest point for wire bonding, then wire bonding can be performed directly, but the blue film directly contacts the pad electrode causing contamination
Solution Approach 1:
The patent introduces a protective electrode as an intermediary element between the blue film and the pad electrode. This protective electrode is positioned higher than the pad electrode to create a height difference, serving as a barrier that prevents the blue film from directly contacting the pad electrode during packaging, thereby eliminating contamination while preserving wire bonding accessibility
Solution Approach 2:
The patent solves the contamination problem by transitioning from a two-dimensional planar arrangement to a three-dimensional structure with height differences. By positioning the protective electrode at a higher elevation than the pad electrode, the solution creates a vertical dimension that separates the blue film contact area from the pad electrode, preventing contamination without affecting wire bonding operations
2Reliability
If the pad electrode surface is clean, then wire bonding quality is high, but the blue film process causes dirt on the pad electrode surface
Solution Approach 1:
The patent applies preliminary protection by positioning the protective electrode before the blue film packaging process occurs. This protective structure is pre-established to prevent contamination from occurring in the first place, rather than attempting to clean or repair the pad electrode after contamination has occurred, ensuring surface cleanliness is maintained throughout manufacturing
3Manufacturing precision
If a protruding protective electrode is added to prevent contamination, then pad electrode cleanliness improves, but device structure becomes more complex
Solution Approach 1:
The protective electrode is designed to serve multiple functions: it acts as a protective barrier against blue film contamination, maintains the pad electrode surface cleanliness, and still allows wire bonding operations to proceed. By consolidating these multiple functions into a single structural element, the patent minimizes the increase in device complexity while achieving the desired contamination prevention
Data Source
AI summary
The disclosure relates to a vertical-type light-emitting diode, which includes a semiconductor stack layer, a first electrode, a second electrode and a protruding protective electrode. The semiconductor stack layer has an upper surface and a lower surface opposite to each other. The semiconductor stack layer includes a first semiconductor layer, a light-emitting layer and a second semiconductor layer stacked in sequence from the lower surface to the upper surface. The first electrode is located on the lower surface of the semiconductor stack layer and connected to the first semiconductor layer. The second electrode is located on the upper surface of the semiconductor stack layer and is connected to the second semiconductor layer, and the protruding protective electrode is connected to the second electrode. The upper surface of the protruding protective electrode is higher than the upper surface of the second electrode.