Vertical LED Self-Assembly Substrate Without Transfer Steps
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Solution Overview
Problem
Current display technologies face challenges in large-area display manufacturing due to the difficulty in transferring and assembling semiconductor light emitting diodes (LEDs) efficiently, particularly with vertical LEDs, which require additional transfer processes and result in high costs and reduced yield.
Innovation Solution
A display device and manufacturing method that utilizes an assembly board as the final board by forming solder connections between semiconductor LEDs and seed metals on the board, allowing for direct electrical connection and self-assembly of vertical LEDs without an additional transfer process, using a combination of electric and magnetic fields for precise placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly technology is used to assemble semiconductor light emitting diodes on an assembly board, then the manufacturing efficiency is improved, but additional transfer processes are required for vertical LEDs which increases device complexity and reduces productivity
Solution Approach 1:
The invention segments the assembly board into multiple cells, each capable of independently holding and assembling semiconductor light emitting diodes. This segmentation allows different regions to handle different LED orientations and types, eliminating the need for additional transfer processes while maintaining self-assembly efficiency.
Solution Approach 2:
The assembly board is designed with multi-functional cells that can accommodate both vertical and horizontal semiconductor light emitting diodes, as well as perform both assembly and final board functions. This universality eliminates the need for separate transfer processes, directly resolving the technical contradiction between manufacturing efficiency and process complexity.
2Productivity
If vertical semiconductor light emitting diodes are assembled directly on the final board, then the number of transfer processes is reduced, but electrical connection becomes difficult due to vertical electrode arrangement
Solution Approach 1:
The invention applies local quality by providing different cell structures for different LED orientations. Cells designed for vertical LEDs include specific electrode arrangements and connection structures that facilitate electrical connection, while cells for horizontal LEDs use different configurations. This localized optimization allows direct assembly on the final board without transfer processes while maintaining ease of electrical connection.
3Area of stationary object
If millions of semiconductor light emitting diodes are required for a large display, then the display area is increased, but the difficulty of transferring and assembling the diodes increases significantly
Solution Approach 1:
The invention transitions from two-dimensional assembly to three-dimensional cell-based assembly. By stacking cells vertically and arranging LED arrays in multiple dimensions, the system can handle millions of LEDs more efficiently. The cell structure allows for parallel processing and assembly of large numbers of LEDs simultaneously, reducing overall assembly difficulty while maintaining large display area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the direct use of an assembly board as a final board for vertical semiconductor LEDs, reducing the need for additional transfer steps and improving manufacturing efficiency and yield, while maintaining electrical connectivity.
Implementation Method 1
assembly electrodes extending in one direction and to be formed at predetermined intervals on the base portion
Implementation Method 2
a solder portion connected to the semiconductor light emitting diode seated in the cell and the seed metal exposed inside the cell is formed on at least a portion of a bottom surface of the cell
Data Source
AI summary
The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.