3D Printed Vertical Metallic Traces via Sacrificial Void
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Solution Overview
Problem
Conventional 3-D printers lack the capability to dispense conductive inks for patterning metallic traces within or on 3D objects, particularly failing to create vertical metallic interconnects or shaped objects due to their setup for thermoplastic materials rather than metallic inks.
Innovation Solution
A fabrication system that uses a combination of non-conductive materials to create a structure with voids, which are then filled with electrically conductive materials, allowing for the creation of vertical metallic traces and other 3D objects by removing sacrificial materials, providing structural support for the conductive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional 3-D printers use thermoplastic materials, then printing capability is maintained, but capability to create metallic traces is lost
Solution Approach 1:
The patent uses sacrificial non-conductive materials (first and second materials) as intermediaries to enable metallic trace fabrication. These sacrificial materials are printed using conventional thermoplastic printing capabilities, then removed to create voids that are filled with conductive material, thereby mediating between the printer's thermoplastic capability and the desired metallic trace outcome
Solution Approach 2:
The patent changes the electrical conductivity parameter of the printed structure by selectively removing non-conductive sacrificial materials and replacing them with conductive materials. This parameter change transforms the structure from entirely non-conductive to having both non-conductive support regions and conductive trace regions
2Ease of manufacture
If hybrid systems print conductive inks, then metallic traces can be created, but vertical interconnects cannot be formed
Solution Approach 1:
The patent extends trace fabrication from the planar dimension to the vertical dimension by using sacrificial materials that can be removed to create three-dimensional voids. These voids can be filled with conductive material to form vertical interconnects, adding the vertical dimension to conventional planar printing capabilities
Solution Approach 2:
The patent performs preliminary printing of sacrificial material structures before removing them and filling with conductive material. This preliminary action creates the three-dimensional framework that enables subsequent vertical interconnect formation, which would be impossible with direct conductive ink printing
3Adaptability or versatility
If sacrificial material is removed to create voids, then vertical metallic traces can be formed, but process complexity increases
Solution Approach 1:
The patent segments the fabrication process into distinct phases: printing sacrificial materials, removing sacrificial materials, and filling voids with conductive material. It also segments the structure into non-conductive support portions and conductive trace portions, making the complex process manageable and enabling vertical interconnect capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of complex, multi-layer circuits, vertical antennas, and metallic waveguides within 3D objects, overcoming the limitations of conventional 3D printing systems by allowing the creation of electrically conductive structures of various shapes and sizes.
Implementation Method 1
the fabrication system is operable to apply heat to the first non-conductive material and the second non-conductive material to liquefy the first non-conductive material and the second non-conductive material
Implementation Method 2
fills the void (such as via injection) with an electrically conductive material
Implementation Method 3
apply a liquid solution to the first non-conductive material in the structure to remove it. Application of the liquid dissolves away the first non-conductive material from the structure
Data Source
AI summary
A fabrication system is operable to form a structure (such as on a substrate) using a combination of a first (electrically) non-conductive material and a second (electrically) non-conductive. In one embodiment, the structure defined by the first material and the second material defines a void (passageway) in the structure. In one embodiment, exposed surfaces of the first non-conductive material and the second non-conductive material define the void in the structure. Subsequent to creating the structure including the void, the fabrication system fills the void (such as via injection) with an electrically conductive material. After the injected electrically conductive material (such as metal epoxy or other suitable material) solidifies, the fabrication system removes the first non-conductive material (sacrificial material) from the structure. The remaining second material provides structural support for the electrically conductive material.