Vertical Micro-Transformer Isolator for Noise Immunity and Breakdown Voltage
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Solution Overview
Problem
Conventional isolators integrated on a single chip face challenges with noise immunity, limited breakdown voltage, and inflexibility in layout due to their design, which affects signal transfer between semiconductor devices with different reference voltage levels.
Innovation Solution
A semiconductor device comprising two chips with vertically aligned coils isolated by insulators, connected via bonding wires, forming a micro-transformer configuration that enhances noise cancellation and increases breakdown voltage through a cascade connection, allowing for improved signal transfer and flexibility in layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If isolators are integrated on a single chip, then device complexity is reduced, but noise immunity and breakdown voltage are limited
Solution Approach 1:
The isolator is divided into two separate chips (first chip and second chip), each containing specific coils. This segmentation allows independent optimization of each chip's structure and enables cascade connection to achieve higher breakdown voltage and better noise immunity while maintaining manageable device complexity
Solution Approach 2:
The patent transitions from planar coil arrangement to vertical alignment of coils across two chips separated by insulators. This three-dimensional configuration increases isolation effectiveness and breakdown voltage by utilizing the vertical dimension for magnetic coupling while maintaining electrical isolation
2Ease of manufacture
If conventional isolator layout is used, then manufacturing is simplified, but layout flexibility and signal transfer performance are reduced
Solution Approach 1:
By separating the isolator into two chips with specific coil configurations, the design allows flexible layout arrangements while maintaining manufacturability through standardized fabrication processes for each chip type
Solution Approach 2:
The vertical alignment of coils across two chips enables improved magnetic coupling and signal transfer performance while allowing flexible planar layout of the chip assembly, resolving the conflict between manufacturing simplicity and layout adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro-transformer configuration doubles the breakdown voltage and improves noise cancellation, providing enhanced signal integrity and flexibility in device layout, while reducing stray capacitance and electromagnetic interference.
Implementation Method 1
at least a first coil and a second coil magnetically coupled in a vertical alignment and isolated by a first insulator in the first chip
Implementation Method 2
isolated by a first insulator in the first chip... isolated by a second insulator in the second chip
Implementation Method 3
at least one bonding wire that connects the second coil in the first chip to the fourth coil in the second chip
Data Source
AI summary
Semiconductor devices for implementing an isolator are described. The semiconductor device can include a first chip including at least a first coil and a second coil magnetically coupled in a vertical alignment and isolated by a first insulator in the first chip. The semiconductor device can further include a second chip including at least a third coil and a fourth coil magnetically coupled in a vertical alignment and isolated by a second insulator in the second chip. The semiconductor device can include at least one bonding wire that connects the second coil in the first chip to the fourth coil in the second chip.