MicroLED Optical Links for High-Density Low-Latency Chip Interconnects
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Solution Overview
Problem
The increasing demand for high computing and networking performance in applications like data centers and artificial neural networks is hindered by the limitations of traditional integrated circuits (ICs), which face challenges in optimizing multiple functionalities simultaneously and require extensive and power-intensive chip-to-chip connections for de-integrated chiplets.
Innovation Solution
The use of optical chip-to-chip interconnects with microLEDs as light sources, enabling high-density connections with linear densities over 10 Tbps/mm and low power consumption, along with vertically and planar launched parallel optical links to interconnect IC chips efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If chip-to-chip connections are used to interconnect de-integrated chiplets, then functionality can be optimized for different purposes (logic, DRAM, I/O), but the connection density decreases and power consumption increases
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources. This substitution fundamentally changes the transmission medium from electrical signals through copper traces to optical signals through free space or waveguides, enabling chip-to-chip communication with dramatically reduced power consumption and increased bandwidth while maintaining the de-integrated chiplet architecture benefits
2Adaptability or versatility
If chip-to-chip connections are used to interconnect de-integrated chiplets, then functionality can be optimized for different purposes (logic, DRAM, I/O), but connection density decreases
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources. This substitution fundamentally changes the transmission medium from electrical signals through copper traces to optical signals through free space or waveguides, enabling chip-to-chip communication with dramatically reduced power consumption and increased bandwidth while maintaining the de-integrated chiplet architecture benefits
Solution Approach 2:
The patent employs vertically-launched parallel optical links that transmit light in the vertical dimension through substrates, rather than being constrained to planar routing. This dimensional transition enables higher connection density by utilizing the third dimension for signal propagation, allowing multiple optical channels to pass through the same horizontal footprint
3Ease of manufacture
If traditional electrical interconnects are used for chip-to-chip connections, then manufacturing is simpler, but latency increases due to slower signal propagation
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources. This substitution fundamentally changes the transmission medium from electrical signals through copper traces to optical signals through free space or waveguides, enabling chip-to-chip communication with dramatically reduced power consumption and increased bandwidth
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides low-latency, high-density, and energy-efficient interconnects for IC chips, overcoming the limitations of traditional chip-to-chip connections and enabling scalable and performant processing and networking architectures.
Implementation Method 1
optical chip-to-chip interconnects with microLEDs as light sources
Implementation Method 2
vertically launched parallel optical links (VLPOLs) optically interconnecting at least some of the integrated circuit chips
Data Source
AI summary
Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.