Embedded Vertical MLCC Assembly for Dense Power Electronics Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current component assemblies for high-power electronics using wide band-gap semiconductor materials like SiC and GaN face challenges in heat mitigation and package density, with conventional techniques failing to effectively manage heat generated by multilayer ceramic capacitors (MLCCs) and requiring inefficient customized assembly and low package density.
Innovation Solution
The solution involves a high-density multi-component package with vertically oriented MLCCs and wide band-gap semiconductor devices, where external terminations serve as both electrical and thermal dissipation interfaces, eliminating the need for through vias and incorporating cooling channels or thermally conducting materials to manage heat, and using transient liquid phase sintering adhesives for interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional techniques are used to manage heat from MLCCs in high-power electronics, then the assembly process is simpler, but heat mitigation is ineffective and leads to thermal runaway
Solution Approach 1:
The patent merges electrical connection and thermal dissipation functions into a single integrated structure. The external terminations of MLCCs are directly bonded to module interconnect pads, creating simultaneous electrical and thermal pathways. This eliminates the need for separate thermal management components and directly addresses heat mitigation while maintaining electrical connectivity.
Solution Approach 2:
The patent introduces transient liquid phase (TLP) sintering adhesive as an intermediary material that enables direct bonding between MLCC external terminations and module interconnect pads. This intermediary facilitates both electrical connection and thermal conduction, allowing effective heat transfer from capacitors to cooling structures while maintaining reliable electrical connectivity.
2Quantity of substance
If MLCCs are packaged in large assemblies to increase capacitance, then capacitance increases, but package density decreases and circuit board area increases
Solution Approach 1:
The patent transitions from planar arrangement of MLCCs to vertical stacking configuration. Multiple capacitors are arranged in layers between module interconnect pads, utilizing the third dimension (height) to increase capacitance without expanding the footprint on the circuit board. This vertical integration directly addresses package density improvement.
Solution Approach 2:
The patent embeds multiple MLCCs within the module structure, nesting capacitors between the module interconnect pads and within the three-dimensional space created by the vertical stacking arrangement. This nesting approach allows multiple capacitive elements to occupy a compact volume, increasing total capacitance while minimizing package size.
3Reliability
If through vias are used for electrical connections in embedded components, then electrical connectivity is achieved, but manufacturing complexity and time increase
Solution Approach 1:
The patent extracts the electrical connection function from the traditional via formation process and integrates it directly into the module assembly structure. Instead of creating through-vias in the substrate, the design uses direct bonding of MLCC external terminations to exposed module interconnect pads, eliminating the need for complex via drilling, plating, and filling operations.
Solution Approach 2:
The patent enables the MLCC external terminations to serve dual purposes: electrical connection and thermal dissipation. The terminations directly bond to module interconnect pads, allowing the capacitor structure itself to provide the electrical pathway without requiring separate via formation processes. This self-service approach simplifies manufacturing.
4Temperature
If the number of internal electrodes is increased to reduce ESR, then self-heating decreases, but manufacturing complexity increases
Solution Approach 1:
The patent segments the thermal management approach by focusing on external heat dissipation through multiple external terminations rather than modifying internal electrode complexity. By increasing the number of external terminations that contact cooling structures, heat is dissipated at the surface level, reducing self-heating without requiring complex internal electrode configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces electrical series resistance and inductance, enhances thermal performance, and allows for larger DC link capacitor assemblies without long metal leads, improving reliability and package density while minimizing the need for costly and time-consuming via formation processes.
Implementation Method 1
using transient liquid phase sintering adhesives for interconnects
Implementation Method 2
external terminations serve as both electrical and thermal dissipation interfaces
Implementation Method 3
incorporating cooling channels or thermally conducting materials to manage heat
Data Source
AI summary
Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.