Vertical Modular Computing Device with Latch Mechanism
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Solution Overview
Problem
Existing portable information handling devices lack the ability to easily expand or upgrade components such as storage or graphics, leading to a fixed configuration that cannot be changed once purchased, resulting in wasted space and accessibility issues with connection ports due to their bulky nature.
Innovation Solution
A modular computing device system comprising a base module with a processor and memory, and interchangeable cap and additional modules that can be stacked using a latch mechanism, allowing users to configure and reconfigure the device as needed without increasing the footprint, with connectors for facilitating electrical connections and alignment features to ensure proper module alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If personal computers use large size and expansion slots to allow easy expansion of functions and features, then adaptability is improved, but device size increases
Solution Approach 1:
The computing device is divided into separate modular components (base module, cap module, and interchangeable modules) that can be independently configured and stacked. Each module contains specific functional components, allowing users to expand capabilities by adding or removing modules without increasing the overall footprint of the base device.
Solution Approach 2:
The patent transitions from horizontal expansion (expansion slots on a single plane) to vertical stacking (adding modules in the vertical dimension). This allows multiple functional modules to be stacked on top of each other, providing expandability without increasing the lateral footprint of the device.
2Area of stationary object
If portable information handling devices are made smaller to improve portability, then device size is reduced, but the ability to expand capabilities is lost
Solution Approach 1:
The device is segmented into a compact base module and separate interchangeable modules. The base module maintains a small portable form factor, while expandability is achieved by stacking additional functional modules vertically, thus preserving portability while enabling capability expansion.
Solution Approach 2:
The patent employs universal connectors and standardized interfaces that allow a single base module to work with multiple different types of interchangeable modules. This multi-functionality enables the compact device to adapt to various needs without requiring multiple separate devices.
3Adaptability or versatility
If interchangeable modules are designed to fit over connectors, then adaptability is improved, but device complexity increases
Solution Approach 1:
Instead of having male connectors protrude from modules, the patent uses female receivers embedded in the module housings that mate with male connectors on the base module. This inversion simplifies the module design by eliminating protruding connector elements and reducing the risk of damage during insertion and removal.
Data Source
AI summary
One embodiment provides a system, including: a base module housing comprising a top, a bottom, and at least one lateral edge comprising a top side and a bottom side, the base module housing comprising: a processor; a memory device operatively coupled to the processor; and at least one connector, disposed at the top side of the base module housing, for facilitating electrical connections; and a cap module housing comprising a top, a bottom, at least one lateral edge comprising a top side and a bottom side, the cap module housing comprising: at least one receiver, disposed at the bottom side of the cap module housing, for receiving at least one connector; wherein the base module housing and cap module housing are vertically connectable using at least one latch mechanism; wherein at least a portion of the at least one latch mechanism is disposed at the top side of the base module housing; and wherein at least a portion of the at least one latch mechanism is disposed at the bottom side of the cap module housing. Other aspects are described and claimed.


