Vertical Mount MEMS Package With Through-Wafer Vias
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Solution Overview
Problem
Existing vertical mount packages for MEMS devices are susceptible to vibration and package tilt, are expensive, and have limitations in manufacturing costs and performance when oriented vertically, which affects the operation of MEMS devices.
Innovation Solution
A vertical mount package design featuring a substrate with pre-formed vias filled with conductive material to form leads, a capping substrate with aligned vias for electrical connection, and exposed conductive elements for mounting, allowing for low-profile and cost-effective packaging with reduced stress on MEMS devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If MEMS devices are packaged in traditional horizontal mount configurations, then manufacturing is simpler, but the package is susceptible to vibration and tilt in automotive applications
Solution Approach 1:
The patent inverts the traditional horizontal mounting orientation to a vertical mounting configuration. The MEMS die is mounted vertically on the substrate, with bond wires extending vertically to connect to pads on the substrate surface. This inversion allows the package to better withstand vibration and tilt in automotive applications by aligning the sensitive MEMS structure vertically rather than horizontally.
Solution Approach 2:
The patent transitions from two-dimensional horizontal mounting to three-dimensional vertical mounting. The bond wires are routed vertically through vias in the substrate, and the MEMS die is positioned vertically above the substrate surface. This dimensional change enables the package to accommodate vibration and tilt forces more effectively in the vertical axis.
2Reliability
If vertical mount packages are implemented, then performance in automotive applications is enhanced, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple functions into the substrate layer: the substrate serves as both the mounting platform for the MEMS die and as the interconnect layer containing vias and pads for electrical connections. The bond wires are integrated directly into the substrate structure through vertical vias, eliminating the need for separate complex interconnect structures. This merging simplifies the manufacturing process while maintaining vertical mounting benefits.
3Length of stationary object
If vertical mount configuration is used, then package profile is reduced, but stress on MEMS devices increases
Solution Approach 1:
The patent applies local quality by creating a localized stress-relief structure at the bond wire attachment points on the MEMS die. The substrate is designed with specific pad configurations and via structures that distribute and reduce stress concentration at critical points where bond wires connect to the MEMS die, thereby minimizing stress on the MEMS devices while maintaining a low profile.
Data Source
AI summary
Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias. MEMS devices or integrated circuits are formed or mounted onto the device regions. A capping substrate having recesses is mounted over the device substrate, enclosing the device regions within cavities defined by the recesses. A plurality of aligned through-wafer contacts extend through the capping substrate and the device substrate. The device substrate and capping substrate can be singulated by cutting through the aligned through-wafer contacts, with the severed through-wafer contacts forming vertical mount leads. A vertical mount package includes a device sealed between a device substrate and a capping substrate. At least of the side edges of the package includes exposed conductive elements for vertical mount leads.