Vertical Mount Package Assembly With Flexible Leads
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Solution Overview
Problem
Existing vertical mount packages for MEMS devices are expensive and susceptible to vibration and tilt, with limited manufacturing cost efficiency and performance, particularly when mounting sensors like gyroscopes and accelerometers vertically.
Innovation Solution
A vertical mount package assembly featuring a base substrate with electrical connections and a package with flexible electrical leads that include aligned grooves, allowing for rotation and secure orthogonal alignment, reducing manufacturing costs while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional vertical mount packages are used for MEMS devices, then the devices can be mounted vertically for applications like automotive sensors, but the packages become expensive and prone to vibration and tilt
Solution Approach 1:
The patent employs flexible electrical leads instead of rigid connections, allowing the package to dynamically adapt to vibrations and tilts while maintaining electrical connectivity. The flexible leads can bend and deform elastically, absorbing mechanical stresses from vibration and orientation changes without compromising the vertical mount configuration or signal integrity.
2Adaptability or versatility
If traditional vertical mount packages are used, then vertical orientation is achieved, but manufacturing cost increases and efficiency decreases
Solution Approach 1:
The patent separates the vertical mounting function from the electrical connection function by using flexible leads that can be independently routed and configured. This segmentation allows the package structure to be optimized for vertical mounting while the electrical connections are handled by the flexible leads, simplifying the manufacturing process and reducing costs compared to integrated rigid solutions.
Solution Approach 2:
The patent changes the physical state of electrical connections from rigid to flexible, enabling the leads to bend and deform elastically. This parameter change allows the same electrical connection structure to accommodate vertical mounting orientations without requiring complex manufacturing processes, thereby reducing manufacturing costs and improving efficiency.
3Reliability
If rigid electrical connections are used in vertical mount packages, then electrical connectivity is maintained, but vibration and tilt cause connection failures
Solution Approach 1:
The patent uses flexible electrical leads that function as thin, flexible membranes or films to maintain electrical connectivity while accommodating vibrations and tilts. These flexible leads can bend and deform elastically, absorbing mechanical stresses from vibration and orientation changes without breaking the electrical connection, thus resolving the contradiction between maintaining connectivity and resisting harmful vibrations.
Data Source
AI summary
Vertical mount package assemblies and methods for making the same are disclosed. A method for manufacturing a vertical mount package assembly includes providing a base substrate having electrical connections for affixing to external circuitry, and providing a package having a mounting region configured to receive a device therein. Flexible electrical leads are formed between the base substrate and the package. The flexible leads can include a plurality of aligned grooves to guide bending. After forming the flexible electrical leads, the package is rotated relative to the base substrate. The aligned grooves can constrain the relative positions of the substrates during rotation, and the beveled edges of the base substrate and package can maintain a desired angular relationship (e.g., perpendicular) between the base substrate and the package after rotation.