Vertical Mounting of Singulated MEMS Sensors
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Solution Overview
Problem
Conventional magnetic field sensors and MEMS devices face challenges in increasing performance, reducing size, and decreasing cost, while also requiring complex microsystems with greater computational power, which are not currently available.
Innovation Solution
A method and structure for fabricating sensors or electronic devices using vertical mounting with interconnections, allowing for the integration of z-axis magnetic field sensors on a single package as X-Y axis sensors, compatible with conventional semiconductor and MEMS process technology, using conductive adhesives or solder processes for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional magnetic field sensors and MEMS devices are used, then existing sensor functionality is maintained, but device size cannot be reduced and integration complexity increases
Solution Approach 1:
The patent combines multiple sensors including z-axis magnetic field sensors, X-Y axis sensors, and MEMS devices into a single integrated package, reducing overall device size while consolidating functionality into one unified structure rather than separate components
Solution Approach 2:
The patent introduces vertical stacking architecture where sensors are arranged in three-dimensional layers, transitioning from conventional two-dimensional planar layouts to three-dimensional vertical integration, thereby reducing footprint area while maintaining sensor functionality
2Volume of moving object
If sensors are integrated on a single package, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary bonding processes where sensor chips are pre-positioned and bonded to the substrate in predetermined locations before final assembly, simplifying the manufacturing sequence and reducing the complexity of integrating multiple sensors on a single package
Solution Approach 2:
The patent divides the sensor integration process into separate stages including individual sensor fabrication, chip bonding, and final package assembly, allowing each segment to be optimized independently while maintaining overall manufacturing feasibility
3Ease of manufacture
If vertical mounting with interconnections is used, then sensor integration is simplified, but manufacturing process complexity increases
Solution Approach 1:
The patent introduces conductive adhesive layers as intermediary bonding agents between sensor chips and substrate, providing both mechanical attachment and electrical interconnection functions simultaneously, thereby simplifying the integration process while managing the complexity of vertical mounting with interconnections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables easy integration of sensors and MEMS devices on CMOS structures, providing improved magnetic sensor and MEMS systems with reduced size and cost, while maintaining compatibility with existing technology, and allowing for the integration of various sensors on a single package.
Implementation Method 1
using conductive adhesives or solder processes for bonding
Implementation Method 2
using conductive adhesives or solder processes for bonding
Data Source
AI summary
A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.