Vertically Stacked Optical Processing Stages for Chip Area Reduction
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Solution Overview
Problem
Current photonic AI processors face challenges in reducing size, power consumption, and cost due to the large size of photonic elements, which are limited by the wavelength of light used.
Innovation Solution
The development of an apparatus with multiple optical processing stages, each comprising configurable optical structures with active regions and interface regions, allows for efficient coupling and processing of optical waves, potentially reducing the size and increasing the speed of photonic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If photonic structures are made smaller to reduce chip area, then chip area advantage is improved, but the size is limited by the wavelength of light which prevents further reduction
Solution Approach 1:
The patent transitions from two-dimensional planar photonic structures to three-dimensional vertically-coupled structures. By stacking multiple optical processing stages vertically and using vertical coupling between stages, the system achieves higher processing density without being constrained by the lateral wavelength limit, effectively utilizing the third dimension to overcome the area-size tradeoff
Solution Approach 2:
The patent implements nested functionality by integrating multiple optical processing stages within a vertically stacked configuration. Each stage contains configurable optical structures that are coupled vertically to adjacent stages, creating a compact nested arrangement where processing functions are embedded within each other in the vertical dimension rather than occupying separate lateral space
2Productivity
If photonic elements are made larger to overcome wavelength limitations, then processing capability is improved, but power consumption and device complexity increase
Solution Approach 1:
The patent divides the photonic processing system into multiple discrete optical processing stages stacked vertically. Each stage performs a portion of the overall processing function and can be independently optimized. This segmentation allows the system to achieve high processing capability through parallel staged operations rather than requiring a single large power-consuming element
Solution Approach 2:
The patent replaces traditional electrical signal processing with optical signal processing throughout the system. Optical waves carry signals between and within processing stages, eliminating the need for electrical-to-optical conversions and reducing power consumption associated with electrical signaling and heat generation in conventional electronic processors
3Speed
If more photonic structures are added to increase processing parallelism, then processing speed is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent resolves the complexity issue by organizing multiple photonic structures in the vertical dimension rather than laterally. The vertically-coupled stages provide processing parallelism through optical multiplexing in the vertical direction, reducing the lateral footprint and simplifying interconnections compared to planar arrangements of equivalent processing capacity
Solution Approach 2:
The patent implements universal configurable optical structures within each processing stage that can perform multiple functions. The configurable optical structures can be programmed to implement different processing operations, allowing the same physical structure to serve multiple purposes across different stages and reducing the need for specialized dedicated structures for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the processing of multiple optical waves with high efficiency, potentially achieving a chip area advantage and reducing power consumption, while allowing for reconfigurable photonic AI processors.
Implementation Method 1
optical waveguiding structures or optical circuits configured to guide optical waves in the optical wavelength region of the electromagnetic spectrum
Implementation Method 2
an interface region configured to receive optical waves from each configurable optical structure in the two or more configurable optical structures; wherein each interface region associated with a respective optical processing stage is configured to couple at least a portion of an optical wave received from at least one configurable optical structure to at least two configurable optical structures in a subsequent optical processing stage
Data Source
AI summary
In one aspect, an apparatus comprises: an integrated circuit device comprising a first layer comprising a metal, a second layer comprising a first semiconductor material, a third layer comprising an active region of a second semiconductor material, and a fourth layer comprising a third semiconductor material, wherein the second layer is between the first and third layers, and the third layer is between the second and fourth layers; an optical interface configured to provide optical waves into different respective portions of the active region along propagation axes that are substantially parallel to each other including first and second propagation axes; a plurality of metal contacts in electrical communication with the fourth layer, wherein first and second subsets of the metal contacts are arranged along the first and second propagation axes; and an electrical source configured to apply a respective electric field between the first layer and each metal contact.