Vertical O-Ring Mounting for Semiconductor Vibration Isolation
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Solution Overview
Problem
Vibrations in components of semiconductor processing systems, such as electrodes, end effectors, and sensors, lead to defects and reduced yield due to misalignment and inaccurate measurements, necessitating a solution to dampen these vibrations.
Innovation Solution
A vibration dampening system using vertically oriented O-rings is introduced to isolate components, reducing the transfer of vibrations by distorting the O-ring shape rather than relying on compression, and optionally using pads for additional isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If components are rigidly mounted to ensure structural stability, then structural strength is improved, but vibration transmission increases
Solution Approach 1:
The patent introduces vertically oriented O-rings as an intermediary element between mounting brackets and components (electrodes, end effectors, sensors). These O-rings are mounted vertically rather than horizontally, allowing them to distort and absorb vibrations while maintaining the structural connection. This mediator approach resolves the contradiction by providing both structural support and vibration isolation.
Solution Approach 2:
The patent changes the mounting orientation parameter of O-rings from the conventional horizontal orientation to vertical orientation. This parameter change allows the O-rings to function differently - they distort vertically to dampen vibrations while maintaining structural integrity. The vertical orientation enables the O-rings to elongate and compress in the vertical direction, providing vibration dampening while preserving structural strength.
2Manufacturing precision
If end effectors are rigidly coupled to lift shafts for precise positioning, then positioning accuracy is improved, but vibration-induced damage increases
Solution Approach 1:
The patent places vertically oriented O-rings between the lift shaft bracket and the end effector lift assembly. These O-rings act as intermediaries that allow precise positioning to be maintained through the vertical mounting structure while simultaneously absorbing vibrations that would otherwise cause damage to the end effector and workpiece during movement.
3Measurement precision
If sensors are firmly mounted on brackets for stable measurement, then measurement stability is improved, but vibration-induced measurement errors increase
Solution Approach 1:
The patent mounts sensors on brackets that are connected to the main structure through vertically oriented O-rings. These O-rings serve as vibration-isolating intermediaries that allow sensors to remain firmly positioned for stable measurements while preventing vibrations from the processing environment from being transmitted to the sensors, thereby eliminating vibration-induced measurement errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces vibrations by up to 80% in end effectors, minimizing damage and improving the precision of semiconductor processing.
Implementation Method 1
vertically oriented O-rings that separate the second component from direct contact with the first component. The vertically mounted O-rings may be disposed between the first component and the second component
Implementation Method 2
dampen vibrations from the lift shaft bracket to the lift shaft by distorting the O-ring shape rather than relying on compression
Data Source
AI summary
A system for coupling a first component and a second component together that dampens the vibrations experienced by the second component is disclosed. The system includes at least one set of vertically mounted O-rings that separate the second component from direct contact with the first component. The vertically mounted O-rings may be disposed between the first component and the second component, or between the second component and a retaining bracket. In some embodiments, the first component may be a mounting bracket and the second component may be an electrode, a sensor, or an end effector.


