Vertical Semiconductor Package Leads for Heat and Isolation
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Solution Overview
Problem
Existing semiconductor packages face challenges in maintaining reliability while minimizing horizontal space on redistribution boards, with current vertical mounting solutions not adequately addressing heat dissipation and electrical isolation issues.
Innovation Solution
The semiconductor package design features leads with recessed distal ends and protruding side faces that are perpendicular to the die surfaces, increasing heat dissipation and electrical isolation, and are embedded in mold compound to enhance reliability and reduce board space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the semiconductor die is mounted with major surfaces parallel to the redistribution board surface, then the electrical connections are simplified, but the horizontal space occupied by the package is large
Solution Approach 1:
The patent transitions from a planar mounting arrangement (die surfaces parallel to board) to a vertical mounting arrangement (die surfaces perpendicular to board). This dimensional change allows the package to utilize the vertical space above the board rather than occupying excessive horizontal area, thereby resolving the contradiction between connection simplicity and space occupation.
2Area of stationary object
If the semiconductor die is mounted vertically with major surfaces perpendicular to the redistribution board surface, then the horizontal space is reduced, but the heat dissipation and electrical isolation are insufficient
Solution Approach 1:
The patent segments the package structure into distinct functional zones: the vertically mounted die, the mold compound encapsulation, and the protruding contact pads extending toward the board. This segmentation allows each component to be optimized independently - the vertical mounting saves space while the protruding contact pads provide dedicated pathways for heat dissipation and electrical isolation, resolving the reliability concerns.
Solution Approach 2:
The mold compound acts as an intermediary material between the vertically mounted die and the redistribution board. It provides thermal management by conducting heat away from the die while simultaneously providing electrical isolation between adjacent contacts, thereby resolving the heat dissipation and electrical isolation issues that arise from vertical mounting.
3Strength
If the lead thickness at the distal end is increased to improve mechanical strength, then the heat dissipation is improved, but the electrical isolation between adjacent contacts is reduced
Solution Approach 1:
The patent applies local quality by varying the lead cross-sectional dimensions along its length. The lead has a thicker section at the die attachment point for mechanical strength and heat conduction, and a thinner protruding distal end for electrical isolation. This localized dimensional variation allows the lead to simultaneously satisfy mechanical strength requirements and electrical isolation requirements.
Data Source
AI summary
A semiconductor package includes a semiconductor die having opposing first and second main surfaces, a first power electrode on the first main surface and a second power electrode on the second main surface, a first lead having an inner surface attached to the first power electrode and a distal end having a first protruding side face extending substantially perpendicularly to the first main surface of the die, a second lead having an inner surface attached to the second power electrode and a distal end having a second protruding side face extending substantially perpendicularly to the second main surface of the die, and a mold compound enclosing at least part of the die and at least part of the first and second leads. The first lead includes a recess positioned in an edge of the inner surface. The second lead includes a recess positioned in an edge of the inner surface.