Vertical Passive Component Layout for Compact Electronic Package Modules
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Solution Overview
Problem
The size of electronic package modules is limited by large passive components, restricting the reduction of module size and the increase in the number of components within a given area.
Innovation Solution
The electronic package module design involves perpendicularly disposing passive components on the circuit substrate, with the input end connected to the substrate and the ground end positioned away from the substrate, allowing for a more compact arrangement and increased component density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components are mounted using surface mount technology with large component sizes, then the components can be easily manufactured and assembled, but the electronic package module size cannot be reduced
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional vertical stacking, where passive components are arranged in multiple layers along the vertical direction. This dimensional change allows components to occupy space in the Z-axis rather than only the XY-plane, significantly reducing the footprint area while maintaining manufacturing feasibility through vertical assembly processes
2Quantity of substance
If the size of electronic package modules is increased to accommodate more passive components, then the component quantity increases, but the module size becomes larger
Solution Approach 1:
The patent implements a nested structure where multiple passive components are stacked vertically one on top of another, similar to nested dolls. Each component is positioned in a layer above or below adjacent components, allowing multiple components to occupy a compact vertical space above a single footprint area, thereby increasing component quantity without proportionally increasing module size
3Device complexity
If passive components are arranged in a planar configuration, then the layout is simple, but the area occupied by each component is large
Solution Approach 1:
The patent resolves the area occupation issue by extending the layout from two-dimensional planar arrangement to three-dimensional vertical stacking. Components are arranged in multiple tiers along the vertical axis, transforming the space utilization from horizontal spread to vertical concentration, thereby reducing the occupied footprint area while managing complexity through systematic layering
Data Source
AI summary
An electronic package module and a method for fabrication of the same are provided. The electronic package module has the circuit substrate with the flat surface and the electronic component located on the circuit substrate. The electronic component includes the input end located on the flat surface of the circuit substrate and electrically connected to the circuit substrate. The electronic component includes the main part located on the input end and the ground end located on the main part. The input end and the ground end are located on two opposite sides of the main part separately and are located between the ground end and the circuit substrate. The input end, the main part and the ground end are arranged along the normal direction of the flat surface.