Vertical Passive Components Reducing PCB Footprint and Solder Bridging
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Solution Overview
Problem
Conventional passive electronic components with horizontal structures face challenges in miniaturization, leading to issues with soldering and space occupancy on target platforms like PCBs, particularly in high-density electronic products, where smaller sizes increase the likelihood of insufficient soldering or solder bridging.
Innovation Solution
Implementing passive components in a vertical configuration with terminal electrodes at the top and bottom surfaces and an external insulation sidewall, which connects the electrodes perpendicular to the target platform, reducing the footprint and preventing solder bridging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are placed horizontally on the target platform, then they can be easily manufactured and assembled, but they occupy substantial area and increase the likelihood of solder bridging
Solution Approach 1:
The patent transitions passive components from a horizontal planar configuration to a vertical three-dimensional structure. The insulator body extends perpendicular to the target platform surface, with first and second contact regions positioned at different heights. This vertical orientation reduces the footprint area on the PCB while maintaining adequate solder contact areas, thereby reducing solder bridging risk and improving soldering reliability.
2Area of stationary object
If passive components are miniaturized to reduce PCB area, then space is saved, but soldering becomes more difficult with increased likelihood of insufficient soldering or solder bridging
Solution Approach 1:
By standing vertically rather than lying flat, the passive component achieves miniaturization in the planar dimension while compensating for soldering accessibility through the vertical dimension. The contact regions are positioned at elevated positions on the insulator body, allowing solder to properly contact the metallic portions without requiring excessively small pad areas, thus maintaining ease of soldering despite reduced PCB footprint.
Solution Approach 2:
The insulator body provides localized metallic contact regions at specific positions (first and second contact regions) rather than requiring the entire component footprint to be metallic. This allows the majority of the component body to be compact insulator material, while the localized metallic contact areas are optimized for reliable soldering, resolving the conflict between miniaturization and soldering ease.
3Reliability
If passive components are placed near IC pins to maximize effectiveness, then functional performance is improved, but they occupy substantial area and compete with interconnect layout routing
Solution Approach 1:
The vertical configuration allows passive components to be positioned closer to IC pins in the planar dimension without requiring extensive horizontal space for the component body itself. The vertical extent of the insulator body provides the necessary electrical and mechanical functionality, enabling effective passive component placement while preserving PCB real estate for interconnect routing and other components.
Data Source
AI summary
An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.