Vertical Photonic Waveguide Stack for Linear and Nonlinear Optics
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Solution Overview
Problem
Integrated photonics face challenges in space constraints and material damage due to high temperature deposition processes, limiting the number and type of components that can be integrated on a single layer of a photonic integrated circuit (PIC), affecting optical performance.
Innovation Solution
A photonic waveguide structure is developed with vertically integrated photonic waveguide layers, allowing for both linear and nonlinear optical operations, using low-temperature sputtering processes to form multiple layers without damaging sensitive materials, enabling integration of diverse materials in any order across multiple layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If high-temperature deposition processes are used to fabricate photonic waveguide layers, then material integration is achieved, but sensitive components are damaged and material combinations are restricted
Solution Approach 1:
The patent changes the temperature parameter from high-temperature deposition to low-temperature deposition processes. This allows sensitive photonic components to be fabricated without thermal damage while still achieving proper material deposition and integration of multiple layers with different material combinations.
2Device complexity
If single-layer photonic integrated circuits are used, then fabrication is simplified, but integration of both linear and nonlinear optical operations is limited
Solution Approach 1:
The patent transitions from a single-layer planar structure to a multi-layer vertical stack configuration. This dimensional change from 2D to 3D architecture enables the integration of both linear and nonlinear optical operations in separate layers, with optical coupling between layers, thereby increasing functional versatility without proportionally increasing fabrication complexity.
3Adaptability or versatility
If multiple materials are integrated in a single layer, then functional complexity increases, but space constraints and material compatibility issues arise
Solution Approach 1:
The patent distributes multiple materials with different optical properties across multiple vertical layers instead of congesting them in a single planar layer. This vertical stacking approach enables integration of diverse materials (e.g., silicon nitride, silicon oxide, chalcogenide glasses) while maintaining adequate spacing and reducing material compatibility issues, effectively utilizing the third dimension to overcome chip area constraints.
Data Source
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AI summary
A photonic waveguide structure includes at least four photonic waveguide layers disposed in a stack configuration. A first photonic waveguide layer, of the at least four photonic waveguide layers, includes a first active structure associated with one or more particular nonlinear optical characteristics, which include a Kerr coefficient that is greater than or equal to 1 × 10-18 meters squared per Watt. A second photonic waveguide layer, of the at least four photonic waveguide layers, includes a second active structure associated with one or more particular linear optical characteristics, which include a propagation loss parameter that is less than or equal to 0.5 decibels per centimeter. The first active structure and the second active structure are formed using one or more sputtering processes, and the first active structure and the second active structure are each configured to transmit light with wavelengths from 350 nanometers (nm) to 5000 nm.