Vertical Plating Layout for Thickness-Based Deviation Control
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Solution Overview
Problem
Conventional vertical continuous plating devices face issues with space utilization, manufacturing yield, and plating quality due to the linear arrangement of substrates, which leads to varying educt effects based on substrate thickness, especially for objects with different thicknesses, and are not suitable for multi-variety and small-batch production.
Innovation Solution
A vertical continuous plating device that allows for horizontal forward/backward and left/right movement of substrates within the plating tank, controlling the educt effect through angle adjustment and movement distance, using a gripping and conveying unit with angularly variable clamps and movement control units to ensure uniform plating quality across varying thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If substrates are arranged in a linear manner within the plating tank, then the plating process can be simplified, but the plating line becomes extended requiring more space and reducing space utilization
Solution Approach 1:
The patent transforms the substrate arrangement from a one-dimensional linear arrangement to a two-dimensional angular arrangement within the plating tank. Substrates are positioned at adjustable angles (0° to 90°) relative to the plating tank lengthwise direction, allowing multiple substrates to be accommodated in a compact space while maintaining effective plating coverage.
2Ease of operation
If substrates are arranged in a linear manner, then the arrangement is simple, but the educt effect varies based on substrate thickness leading to plating quality issues
Solution Approach 1:
The patent introduces dynamic adjustability to the substrate arrangement system. The gripping and conveying unit can change the arrangement angle of substrates from 0° to 90° relative to the plating tank lengthwise direction, allowing the system to adapt to different substrate thicknesses and optimize the educt effect for each case, thereby ensuring uniform plating quality.
Solution Approach 2:
The patent changes the arrangement angle parameter of substrates within the plating tank to optimize plating quality. By adjusting the angle at which substrates are positioned and moved, the system controls the educt effect to ensure uniform plating across substrates of varying thicknesses.
3Area of stationary object
If the plating tank size is reduced to improve space utilization, then multiple plating lines can be installed, but it becomes difficult to accommodate substrates with different thicknesses effectively
Solution Approach 1:
The patent employs a dynamic gripping and conveying unit that can adjust the arrangement angle of substrates from 0° to 90°. This dynamic capability allows a compact plating tank to effectively accommodate substrates of varying thicknesses by optimizing the substrate position and movement path for each thickness category, thereby maintaining versatility in a reduced space.
4Device complexity
If substrates are moved only forward and backward along the longitudinal direction, then the mechanism is simple, but the overall movement distance is limited reducing manufacturing yield
Solution Approach 1:
The patent adds a dimensional aspect to substrate movement by introducing angular variation (0° to 90°) in addition to the forward-backward motion. This creates a two-dimensional movement pattern within the plating tank, extending the effective movement distance and coverage area, thereby increasing the number of substrates that can be processed and improving manufacturing yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves manufacturing yield and space utilization by reducing plating tank size, enabling multiple plating lines, and ensures uniform plating quality for objects with different thicknesses, suitable for multi-variety and small-batch production.
Implementation Method 1
an eductor for circulating a plating solution, removing air adhered to the substrates, and maximizing plating in holes
Implementation Method 2
a vertical continuous plating device, one of the conventional forms of electroplating lines, is a device in which substrates are hung vertically on a conveyor allowing current to flow therethrough to deposit plating materials onto their surfaces
Data Source
Figure 1(a)~2
Figure 3~4(b)
Figure 5~6a
AI summary
The present invention relates to a vertical continuous plating device enabling to control plating deviation based on a thickness difference of to-be-plated objects. The present invention aims to allow the to-be-plated objects, within a plating tank comprising an eductor, to be gripped in an angularly adjustable manner, and to maximize an educt effect for the to-be-plated objects within the plating tank through a forward/backward and left/right movement of the to-be-plated objects, thereby improving the manufacturing yield and quality and increasing space utilization compared to the same space due to a reduction in the size of the plating tank.