Vertical Continuous Plating Layout for Thickness-Based Deviation Control
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Solution Overview
Problem
Conventional vertical continuous plating devices face issues with space utilization, manufacturing yield, and plating quality due to the linear arrangement of substrates, which leads to varying e-duct effects based on substrate thickness, especially for objects with different thicknesses, and are inefficient for multi-variety and small-batch production.
Innovation Solution
A vertical continuous plating device that allows for angular adjustment and horizontal forward/backward and left/right movement of substrates within the plating tank, controlling the e-duct effect based on substrate thickness to ensure uniform plating quality and reduce plating deviation, enabling a reduction in tank size for increased space utilization and installation of multiple lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If substrates are arranged in a linear manner within the plating tank, then the plating process is simple to implement, but the space utilization is significantly low and the plating line becomes extended
Solution Approach 1:
The patent transitions from a one-dimensional linear arrangement to a two-dimensional angular arrangement within the plating tank. Substrates are positioned at adjustable angles relative to the e-ductors, allowing them to be arranged more densely in the horizontal plane while maintaining effective e-duct exposure. This dimensional change increases the number of substrates that can be accommodated in the same tank space.
2Ease of manufacture
If substrates are arranged in a linear manner, then the setup is straightforward, but the manufacturing yield decreases due to reduced number of substrates that can be manufactured
Solution Approach 1:
The patent introduces adjustable and movable mechanisms that allow the substrate arrangement angle and position to be dynamically changed during the plating process. The gripping and conveying unit can adjust substrate positions in real-time, enabling optimal e-duct exposure for different substrate thicknesses while maintaining high production capacity. This dynamic adjustment capability increases manufacturing yield without sacrificing operational simplicity.
3Adaptability or versatility
If substrates of different thicknesses are plated using conventional vertical continuous plating devices, then the plating process can handle variety, but plating deviation occurs due to varying e-duct effects
Solution Approach 1:
The patent applies local quality by adjusting the e-duct exposure conditions specifically for different substrate thicknesses. Thinner substrates are positioned at angles or positions that maximize e-duct effect, while thicker substrates are positioned to ensure adequate penetration. The gripping and conveying unit enables localized adjustment of substrate positions and angles, ensuring uniform plating quality across substrates of varying thicknesses within the same plating tank.
4Area of stationary object
If the plating tank size is reduced to increase space utilization, then multiple plating lines can be installed, but the plating process becomes more constrained
Solution Approach 1:
The patent employs dynamic adjustment mechanisms within the plating tank that allow substrate arrangement angles and positions to be changed during operation. The gripping and conveying unit can adapt substrate positions in real-time, providing the flexibility needed for different substrate thicknesses even in a reduced tank size environment. This enables multiple plating lines to be installed while maintaining process versatility through automated positional adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device improves manufacturing yield and quality by maximizing the e-duct effect and reducing plating deviation, allowing for efficient multi-variety and small-batch production through optimized substrate arrangement and movement.
Implementation Method 1
an e-ductor for circulating a plating solution, removing air adhered to the substrates, and maximizing plating in small holes
Implementation Method 2
a vertical continuous plating device, one of the conventional forms of electroplating lines, is a device in which substrates are hung vertically on a conveyor allowing current to flow therethrough to deposit plating materials onto their surfaces
Data Source
AI summary
The present invention relates to a vertical continuous plating device enabling to control plating deviation based on a thickness difference of to-be-plated objects. The present a invention aims to allow the to-be-plated objects within plating tank to be gripped in an angularly adjustable manner, and to maximize an e-duct effect for the to-be-plated objects within the plating tank through a forward/backward and left/right movement of the to-be-plated objects, thereby improving the manufacturing yield and quality and increasing space utilization compared to the same space due to a reduction in the size of the plating tank.