Vertical Power Supply Board Layout for Lower Loop Impedance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The conventional vertical power supply systems face challenges in reducing transmission impedance and improving dynamic performance due to limited output capacitors, which are embedded in the substrate, leading to increased area requirements, manufacturing difficulties, and mismatch stress from differing thermal expansion coefficients.
Innovation Solution
The capacitors are disposed on the surfaces of the system board and substrate, allowing for a three-dimensional arrangement, increasing the quantity and reducing loop impedance, and utilizing a variety of materials with lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If output capacitors are embedded in the substrate, then the power supply system achieves compact integration, but the substrate area increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from two-dimensional planar embedding of capacitors within the substrate to three-dimensional surface mounting on both sides of the substrate. This dimensional change allows capacitors to be arranged vertically and on multiple surfaces, dramatically increasing the number of capacitors that can be installed without increasing the substrate's planar area.
2Quantity of substance
If more output capacitors are embedded in the substrate, then the total capacitance increases, but the substrate becomes more prone to bending and manufacturing difficulties arise
Solution Approach 1:
The patent extracts the capacitors from the substrate's internal embedding structure and relocates them to the substrate's outer surfaces. This separation removes the mechanical constraint where embedded capacitors caused the substrate to bend during manufacturing, while still achieving high total capacitance through increased capacitor quantity on the surfaces.
3Volume of moving object
If output capacitors are embedded in the substrate, then space utilization is improved, but the quantity of capacitors per unit area is limited
Solution Approach 1:
The patent utilizes both surfaces of the substrate for capacitor mounting, effectively doubling the available area. Combined with vertical stacking arrangements, this three-dimensional approach dramatically increases the number of capacitors per unit area compared to traditional single-sided or embedded configurations.
4Adaptability or versatility
If different materials with different thermal expansion coefficients are used, then design flexibility and cost are improved, but mismatch stress increases
Solution Approach 1:
The patent separates the capacitors from the substrate's internal structure and mounts them independently on the surfaces. This extraction reduces the mechanical coupling between substrates and capacitors, thereby reducing thermal mismatch stress while allowing greater flexibility in material selection for both components.
Data Source
AI summary
A vertical power supply system includes a system board, a substrate, a chip unit, a plurality of first capacitors, a plurality of connection boards, a plurality of third capacitors, and a power unit. The system board includes a first surface and a second surface which are opposite to each other. The substrate includes a third surface and a fourth surface which are opposite to each other, and the third surface is located between the fourth surface and the second surface. Each of the connection boards includes a first end, a second end and a side wall. The first end and the second end are opposite to each other. The first end is electrically connected to the second surface of the system board. The second end is electrically connected to the third surface of the substrate. The chip unit is disposed on the first surface.