Vertical Power Delivery Module for Low-Inductance Semiconductor Loads
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Solution Overview
Problem
Contemporary electronic systems face challenges in efficiently supplying high power currents to large semiconductor dies like CPUs and GPUs due to space constraints and thermal management limitations, necessitating improved power connections and conversion methods.
Innovation Solution
A method involving a power conversion module with a multi-cell structure and an interconnection module is used, where conversion cells are arranged in specific patterns with varying spacings, and the modules are stacked to form a sandwich structure with electrical and mechanical translation, utilizing sintering or soldering processes for connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power is conducted laterally through the substrate to the die, then power can be delivered to the semiconductor device, but the lateral power connection traverses a horizontal distance that is much greater than the vertical distance, resulting in increased interconnection inductance and reduced power delivery efficiency
Solution Approach 1:
The patent transitions from lateral power delivery (horizontal dimension) to vertical power delivery (vertical dimension) by stacking the power conversion module directly on the substrate beneath the die. This dimensional change reduces the current path length and interconnection inductance, improving power delivery efficiency to high-current semiconductor devices.
2Ease of manufacture
If the converter output terminals are arranged in a first pattern with a first spacing, then the power conversion module can be assembled to the interconnection module, but the power input terminals require a second pattern with a second spacing that is different than the first spacing, requiring translation
Solution Approach 1:
The interconnection module serves as an intermediary component between the power conversion module and the semiconductor device. It provides terminal pattern translation by having x-input terminals arranged in a first pattern matching the converter outputs and x-output terminals arranged in a second pattern matching the die inputs, thereby decoupling the spacing requirements of different modules.
3Productivity
If feature sizes decrease and transistor counts increase, then the semiconductor device can achieve higher performance, but the power supply current requirements increase, demanding large numbers of connector pins and leads
Solution Approach 1:
The patent employs vertical stacking to deliver power from the power conversion module through the interconnection module directly to the die, reducing the need for numerous lateral connector pins and leads. The vertical power delivery path enables high current supply with fewer interconnection points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient power delivery to semiconductor devices with reduced interconnection inductance and improved thermal management, accommodating high current demands while optimizing space utilization.
Implementation Method 1
utilizing sintering or soldering processes for connections
Implementation Method 2
utilizing sintering or soldering processes for connections
Data Source
AI summary
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Solder may be dispensed into the holes for surface mounting. Two or more panels may be stacked prior to singulation to form module stacks.Delivering power vertically to semiconductor dies is described using multi-cell converters having a relatively large cell and output terminal pitch. Translation interconnections may be provided in a semiconductor package substrate, a system PCB, or in an interconnection module. The translation interconnections or interconnection module may provide vertical power delivery to semiconductor devices through a semiconductor power grid having a small pitch. The converters and interconnection modules may be fabricated in panels and stacked prior to singulation. Sintering techniques may be used to interconnect some or all of the functional layers of the stack.