Vertical Power Delivery Packaging for Low-Loss Processor Supply
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Solution Overview
Problem
Traditional power delivery technologies face challenges in providing high current to processors in high performance computing systems due to voltage drops and dielectric breakdowns, leading to excessive energy wastage and voltage regulation issues, as they laterally deliver power through the package substrate.
Innovation Solution
A packaging structure with a DC-DC power converter attached to the bottom surface of the package substrate, which receives input power vertically through external cables, eliminating lateral current movement and reducing power density loss by directly supplying power vertically to the processor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power is delivered laterally through the package substrate, then the processor can receive power, but voltage drops and dielectric breakdowns occur leading to excessive energy wastage
Solution Approach 1:
The patent transitions from lateral power delivery (horizontal dimension) to vertical power delivery (vertical dimension) by positioning the DC-DC power converter beneath the package substrate. This dimensional change shortens the current path, reducing IR drops and dielectric breakdown risks while improving voltage regulation and reducing energy wastage.
2Loss of energy
If traditional lateral power delivery is used, then the structure is simple, but voltage regulation issues and excessive energy wastage occur
Solution Approach 1:
The patent introduces vertical power delivery architecture that places the DC-DC power converter in the vertical dimension (beneath the package substrate), fundamentally changing the power delivery path from lateral to vertical. This resolves the energy wastage issue while the modular converter design manages the added structural complexity.
3Reliability
If vertical power delivery is implemented, then power density loss is reduced and voltage regulation is improved, but the packaging structure becomes more complex
Solution Approach 1:
The patent segments the power delivery function into a separate DC-DC power converter module positioned beneath the package substrate. This segmentation allows the converter to be optimized independently for voltage regulation performance while being integrated into the existing package architecture through standard interconnect structures, managing the complexity through functional separation.
Solution Approach 2:
The DC-DC power converter acts as an intermediary component between the external power source and the processor, positioned vertically beneath the package substrate. This intermediary enables efficient vertical power delivery while isolating the processor from the complexity of power conversion operations, achieving good voltage regulation without proportionally increasing overall system complexity.
Data Source
AI summary
A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.