Vertical Power Module Layout for High Current Density and Cooling
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Solution Overview
Problem
Conventional power modules face challenges in achieving higher current density and heat dissipation capabilities due to limitations in semiconductor devices and reduced size, which affects their performance in applications requiring greater power density.
Innovation Solution
The power module design involves vertically installing a magnetic component and semiconductor device perpendicular to a welding surface, reducing the welding surface area and enhancing heat dissipation by connecting the semiconductor device to the magnetic component through vias in the circuit board, with heat dissipation occurring from the top of the magnetic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the conventional structure with semiconductor device at top, inductor in middle, and capacitor at bottom is used, then the power density is improved to a certain extent, but the volume cannot be further reduced due to semiconductor device limitations
Solution Approach 1:
The patent transitions from a horizontal arrangement of power module components to a vertical stacking configuration along the Z-axis. The semiconductor device, magnetic component, and capacitor are arranged in multiple layers perpendicular to the substrate, effectively utilizing three-dimensional space. This dimensional change allows for higher power density within a reduced footprint area while maintaining adequate heat dissipation pathways through the vertical structure.
2Quantity of substance
If the size of the power module is reduced, then the power density increases, but heat dissipation problems inevitably arise
Solution Approach 1:
The patent implements localized heat dissipation structures including thermal vias positioned beneath hot spots on the substrate, heat sinks attached to specific high-heat-generating components, and thermal coupling between adjacent layers. This local quality approach ensures that heat is efficiently managed at the source without requiring the entire module to be oversized for thermal management, thus maintaining high power density while addressing heat dissipation concerns in critical areas.
3Area of stationary object
If components are arranged horizontally in conventional layout, then the welding surface area is large, but the current density is limited
Solution Approach 1:
The patent employs vertical stacking of components along the Z-axis, with input and output terminals extending through multiple layers. This three-dimensional configuration reduces the horizontal welding surface area on the substrate while maintaining electrical connectivity through vertical vias and interlayer connections. The current density is enhanced by concentrating current flow through reduced cross-sectional areas in the vertical dimension, achieving higher current density without proportionally increasing the overall module volume.
Data Source
AI summary
A power module is disclosed, and includes a semiconductor device, a magnetic component and a first circuit board. The magnetic component includes a magnetic core and a winding. The winding extends through the magnetic core. The semiconductor device, the magnetic component and the first circuit board are arranged in a stack along a first direction. The first side of the semiconductor device is welded on a side of the first circuit board. At least one of the lower surface of the magnetic component and the lower surface of the first circuit board forms a welding surface. The power module receives input signals from an exterior through the welding surface and transmits output signals to the exterior through the welding surface.