Vertical Power PCB Assembly With Shorter SoC Delivery Paths
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Solution Overview
Problem
Existing printed circuit board arrangements for vertical power delivery to integrated electronic devices suffer from increased inductive losses due to lengthy power connections through multiple panels, which affect efficiency.
Innovation Solution
A modified circuit board assembly is introduced, featuring a reduced thickness base power panel with a raised power panel and a signal panel designed with a central cutout, allowing for shorter vertical power delivery paths by mounting the signal panel flush with the raised power panel, and using anisotropic conductive materials for bonding, thereby reducing the length of adhesive 103, and prepreg laminate, and plated through holes for forming electrical connections between panels, and plated through holes drilled through all panels configured to form vertical electrical connections between contacts on the panels and the SoC.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power is delivered through multiple stacked panels (base power panel, raised power panel, signal panel), then vertical power delivery is achieved, but inductive losses increase due to lengthy power connections
Solution Approach 1:
The patent transitions from horizontal power delivery through multiple stacked panels to vertical power delivery through a single reduced-thickness base power panel. This dimensional change eliminates the need for power connections to traverse multiple panel interfaces, thereby reducing connection length and inductive losses while maintaining effective power delivery to the integrated electronic device
2Productivity
If a raised power panel is added to reduce power connection length, then vertical power delivery efficiency improves, but device complexity increases
Solution Approach 1:
The patent extracts the power delivery function from the multi-panel stack and concentrates it in the base power panel with reduced thickness. By removing unnecessary panel layers and their associated interfaces, the design achieves vertical power delivery efficiency while reducing overall assembly complexity compared to traditional multi-panel configurations
3Loss of energy
If panel thickness is reduced to shorten power paths, then inductive losses decrease, but manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes the base power panel thickness parameter to achieve an optimal balance between reducing inductive losses and maintaining manufacturability. By carefully selecting and controlling the thickness parameter within specific ranges, the design reduces power path length and energy losses while staying within practical manufacturing tolerance capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified assembly reduces inductive losses and enhances power delivery efficiency by shortening the vertical power delivery paths, thereby improving power delivery to integrated electronic devices.
Implementation Method 1
using anisotropic conductive materials for bonding, thereby reducing the length of adhesive 103
Data Source
AI summary
Examples are disclosed that relate to printed circuit board (“panel”) arrangements for vertical power delivery from voltage regulators to an integrated electronic device mounted to the circuit board arrangement. One disclosed example assembly comprises a base power panel, a raised power panel mounted to the base power panel, a signal panel mounted to the base power panel such that a surface of the signal panel is generally flush with a surface of the raised power panel, and an integrated electronic device mounted to the raised power panel and the signal panel.