Vertical Power Semiconductor Components in Common Body
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Solution Overview
Problem
The existing methods for assembling power semiconductor components require high manufacturing effort and long process times due to the need for separate mounting of individual components.
Innovation Solution
The integration of at least two vertical power semiconductor components into a common semiconductor body allows for joint mounting on a substrate, with load terminals on opposite sides for external contact and optional electrical decoupling using edge structures, diode junctions, or insulating layers, enabling efficient assembly of power semiconductor modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual power semiconductor components are mounted separately on separate metallization areas, then each component can be independently connected and electrically isolated, but the manufacturing outlay and process time increase significantly
Solution Approach 1:
Multiple power semiconductor components are integrated into a single semiconductor body, allowing them to be mounted together as one unit on a common metallization area. This merging reduces the number of separate mounting operations while maintaining electrical isolation through integrated field rings or insulating structures within the semiconductor body.
Solution Approach 2:
The common metallization area serves multiple functions: it provides electrical connection for all components simultaneously, acts as a common reference potential, and enables integrated cooling. This multi-functional approach replaces multiple separate connection processes with a single universal mounting operation.
2Ease of manufacture
If multiple components are arranged on a common metallization area, then the mounting process is simplified, but electrical decoupling between adjacent components becomes more complex
Solution Approach 1:
Field rings or insulating structures are placed locally at specific positions between adjacent components on the common metallization area. These localized features provide electrical decoupling only where needed, while leaving other areas open for electrical connection. This approach maintains mounting simplicity by integrating decoupling features directly into the mounting structure rather than requiring separate decoupling components.
3Loss of time
If vertical power semiconductor components are integrated into a common semiconductor body, then joint mounting is enabled and manufacturing time is reduced, but the complexity of integrating multiple components into one body increases
Solution Approach 1:
The common semiconductor body is segmented into distinct regions, each housing a specific power semiconductor component. Field rings or insulating structures create electrical segmentation between these regions. This segmentation allows independent design and fabrication of each component region while enabling integrated mounting of the complete multi-component system as a single unit, reducing overall process time.
Data Source
AI summary
A power semiconductor component is disclosed. One embodiment provides a semiconductor body, in which at least two vertical power semiconductor components are arranged. Each of the vertical power semiconductor components has a first load terminal arranged at a front side of the semiconductor body. Each of the vertical power semiconductor components has a second load terminal arranged at a rear side of the semiconductor body opposite the front side.