Vertical Power Supply Configuration Reducing Current Path Losses
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Solution Overview
Problem
High current power supply applications face significant losses due to the distance between the power supply apparatus and the processor chip in horizontal power supply systems, leading to reduced power supply efficiency.
Innovation Solution
A vertically powered electronic device configuration is proposed, where the power supply apparatus and the processor chip are placed on opposite sides of the system board, reducing the current path length and minimizing losses. Additionally, output capacitors are integrated into the power supply apparatus, and the pins of the power supply apparatus are connected to the system board vias in close proximity to avoid each other.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If horizontal power supply mode is used with power supply apparatus and processor chip on the same side of system board, then ease of manufacture and standard PCB layout are maintained, but power supply losses increase significantly to 5%-10% at high currents
Solution Approach 1:
The patent transitions from horizontal power supply layout to vertical power supply layout, changing the spatial dimension of current flow. The power supply apparatus is positioned vertically above the processor chip through system board vias, creating a vertical current path that significantly reduces the current path length and associated power losses compared to horizontal routing.
2Productivity
If vertical power supply configuration is adopted to reduce current path length, then power supply efficiency improves with losses reduced to less than 1%, but device complexity increases due to via interconnections
Solution Approach 1:
The patent merges the power supply apparatus, output capacitors, and processor chip into a vertically integrated configuration. The output capacitors are positioned vertically adjacent to the processor chip and electrically connected through the same via structure, combining multiple power supply components into a unified vertical assembly that reduces overall complexity despite the vertical architecture.
3Reliability
If output capacitors are placed on the back side of system board facing the processor, then decoupling effect is improved, but additional via interconnections are required increasing manufacturing complexity
Solution Approach 1:
The patent implements a nested vertical arrangement where output capacitors are positioned vertically adjacent to the processor chip, with the capacitors, vias, and chip forming a compact vertical stack. This nested configuration allows the capacitors to be electrically connected to the processor through the same via structure, integrating multiple functions into a single vertical space rather than requiring separate horizontal mounting areas.
Data Source
AI summary
An electronic device includes: a system board; a load, located on the first side of the system board and including a power supply region, the power supply region includes load pins arranged in a plurality of rows and in a plurality of columns; and at least one column of output capacitors, located on the second side of the system board along a third direction; at least one row of the load pins is a first arrangement row, the first arrangement row includes a plurality of load pin groups arranged sequentially along the second direction, each of the load pin groups includes at least two load pins of a same polarity; and two ends of a vertical projection of each column of the output capacitors on the power supply region are located at two sides of a centerline, in the third direction, of at least one first position pin.