Vertical Pressure Sensor Assembly Integration

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Solution Overview

Problem

Conventional pressure sensors face challenges in minimizing sectional area for installation and improving assembly efficiency, especially in densely packed systems like the antilock brake system (ABS) for automobiles, leading to increased vertical size and manufacturing costs due to the use of elastic terminals and separated circuit boards.

Innovation Solution

A vertical pressure sensor design featuring a diaphragm with strain gauges attached symmetrically around its center, connected via electrode terminals exposed through grooves in a socket unit, and a shielding shell to reduce size and enhance assembly efficiency, stability, and electromagnetic shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a conventional pressure sensor design with separate circuit boards and elastic terminals is used, then the sensor can be assembled with standard components, but the vertical size increases and assembly efficiency decreases

Engineering Contradiction:
Improveassembly efficiencyVSAvoidvertical size
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent combines the first circuit board (with Wheatstone bridge circuit) and the second circuit board (with signal processing circuit) into a single integrated circuit board. This merging eliminates the need for elastic terminals and the space between separate boards, thereby reducing vertical size while simplifying the assembly process. The integrated board maintains all necessary electrical connections without requiring additional assembly steps for aligning and connecting separate boards.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent removes the elastic terminals from the sensor structure. By extracting this component, the vertical space required for terminal accommodation is eliminated, and the assembly process is simplified as elastic terminals require precise alignment and insertion steps. The electrical connections previously made through elastic terminals are now directly integrated onto the circuit board.

Inventive Principle:
Principle #2Taking out (Extraction)

2Area of stationary object

If the sectional area for installation is limited, then the sensor can be mounted in densely packed systems, but the vertical size must be reduced

Engineering Contradiction:
Improvesectional areaVSAvoidvertical size
Core Design Contradiction:
Area of stationary objectVSLength of stationary object

Solution Approach 1:

The patent redistributes the sensor components in a planar configuration on the integrated circuit board, optimizing the use of horizontal space. By arranging the diaphragm, strain gauges, and circuit elements in a two-dimensional layout rather than extending vertically, the sensor achieves a compact footprint suitable for densely packed installations while maintaining functional performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If strain gauges are connected to circuit boards via wire bonding through a hole in the circuit board, then electrical connection is achieved, but the distance between strain gauges and circuit board increases

Engineering Contradiction:
Improveelectrical connectionVSAvoiddistance between strain gauges and circuit board
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The patent introduces electrode terminals as intermediary elements that extend from the circuit board surface toward the strain gauges. These terminals provide a stable connection point that reduces the effective distance between the strain gauges and the circuit board, eliminating the need for long inclined wires and improving mechanical stability while maintaining electrical connectivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Adaptability or versatility

If multiple circuit boards are used for signal processing, then functional requirements are met, but device complexity increases

Engineering Contradiction:
Improvesignal processing capabilityVSAvoidnumber of circuit boards
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent integrates multiple circuit functions (Wheatstone bridge circuit for signal generation and signal processing circuit for data handling) onto a single circuit board. This consolidation reduces the overall device complexity by eliminating the need for multiple separate boards, inter-board connections, and associated alignment procedures, while preserving all necessary signal processing capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design reduces the vertical size of the pressure sensor, simplifies assembly, improves stability and safety, and enhances shielding performance, making it more productive and resistant to electromagnetic interference.

Implementation Method 1

a diaphragm is generally provided perpendicularly to the direction in which pressure is applied such that the diaphragm can be finely elastically deformed due to the pressure applied to the diaphragm

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

four strain gauges are attached to the top of the diaphragm so as to convert the elastic deformation of the diaphragm into an electrical signal (generally, a voltage displacement difference)

Methodology Applied
Scientific EffectStrain gauge measurement: Piezoresistive Effect

Data Source

PatentEP2488843B1Vertical pressure sensor
Publication Date: 2021.10.27 TYCO ELECTRONICS AMP KOREA
  • EP2488843B1 patent drawingFigure 1
  • EP2488843B1 patent drawingFigure 2
  • EP2488843B1 patent drawingFigure 3

AI summary

Disclosed herein is a vertical pressure sensor. The vertical pressure sensor includes a pressure application unit having a diaphragm to which strain gauges are attached, a socket unit surrounding a circumference of the diaphragm of the pressure application unit, the socket unit having a through hole, first to fourth electrode terminals provided at the upper end of the socket unit in a Wheatstone bridge circuit pattern, one end of each of the electrode terminals exposed through the through hole being electrically connected to a corresponding one of the strain gauges by wire bonding, the other end of each of the electrode terminals protruding from the upper end of the socket unit to constitute an electrode tip, a circuit board connected to the first to fourth electrode terminals to convert a pressure value into an electrical signal, and electrode rods connected to the circuit board to transmit the electrical signal outside.