Vertical Probe Card Flexible PCB Signal Integrity
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Solution Overview
Problem
Conventional vertical probe cards experience high insertion loss and impedance discontinuity, especially for high-frequency signals, due to limited bandwidth and structural limitations, leading to inefficient signal transmission and increased production costs.
Innovation Solution
The design incorporates a flexible PCB with controlled impedance for high-frequency signal transmission and a large area copper foil for power supply, allowing for separate signal and power routes, reducing insertion loss and ensuring signal integrity by combining flexible and rigid PCBs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signals are transmitted through through holes in the PCB, then signal transmission is achieved, but insertion loss increases and impedance discontinuity occurs
Solution Approach 1:
The patent segments the signal transmission path by separating high-frequency signals from general signals. High-frequency signals are transmitted through dedicated controlled impedance lines on the PCB surface, while general signals use traditional through-hole paths. This segmentation prevents high-frequency signals from suffering insertion loss through through-holes while maintaining reliable transmission for both signal types.
Solution Approach 2:
The patent transitions from vertical through-hole transmission to horizontal surface transmission for high-frequency signals. By routing high-frequency signals along the PCB surface using controlled impedance lines rather than forcing them through vertical through-holes, the patent eliminates impedance discontinuity and reduces insertion loss while maintaining signal transmission reliability.
2Power
If power supply current flows through through holes in the vertical direction, then power delivery is achieved, but inductance increases causing SSN and high target impedance
Solution Approach 1:
The patent changes the power delivery path from vertical through-hole transmission to horizontal surface transmission using large area copper foils on the PCB. This dimensional change allows current to flow through a much larger cross-sectional area, reducing inductance and eliminating SSN while maintaining power supply capability.
Solution Approach 2:
The patent makes the PCB copper layers serve multiple functions: they provide both signal transmission paths and power delivery paths. By using large area copper foils for both power and ground, the PCB structure achieves low inductance power delivery while also providing stable reference planes for high-frequency signals, reducing target impedance.
3Adaptability or versatility
If the bandwidth is limited for the vertical probe card, then the structure remains simple, but test capability is restricted to lower frequencies
Solution Approach 1:
The patent applies local quality by providing different transmission path characteristics for different signal types. High-frequency signals receive dedicated controlled impedance lines with specific electrical characteristics, while general signals use standard PCB traces. This localized optimization enables the probe card to handle both high-frequency and low-frequency signals effectively without requiring complete structural redesign.
Data Source
AI summary
The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.