Vertical Probe With Depressed Slots for High-Density IC Testing
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Solution Overview
Problem
Conventional probes, both cantilever and vertical, face challenges when testing integrated circuit devices with high-density pads, as cantilever probes require lateral space and may cause short circuits due to excessive deformation in vertical probes.
Innovation Solution
A vertical probe with a depressed structure featuring parallel slots on its linear body allows for vertical displacement without lateral space requirements, enabling the probe to bend to one side and prevent short circuits, while reducing pressure on the bottom guide plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cantilever probe is used to provide vertical displacement and prevent excessive probe pressure, then the integrated circuit device is protected from damage, but the probe requires lateral space that prevents fine pitch arrangement for high-density pin devices
Solution Approach 1:
The invention transitions from lateral displacement (cantilever probe bending horizontally) to vertical displacement (probe body compressing vertically). The depressed structure with slots enables the probe body to compress in the vertical direction, eliminating the need for lateral space while maintaining stress relief functionality.
Solution Approach 2:
The invention changes the mechanical parameter of displacement direction from lateral to vertical. By introducing the depressed structure with slots, the probe body can undergo vertical compression deformation, fundamentally altering how the probe absorbs contact stress without requiring lateral clearance.
2Area of moving object
If a vertical probe with large body deformation is used to provide vertical displacement, then fine pitch arrangement is enabled for high-density pin devices, but adjacent probes may contact each other causing short circuits or collisions
Solution Approach 1:
The invention introduces slots at specific locations on the probe body to create localized deformation zones. The depressed structure with slots concentrates the compression deformation in specific regions rather than requiring uniform large-scale bending, enabling controlled vertical displacement without excessive lateral movement that would cause probe interference.
Solution Approach 2:
The invention redirects deformation from the lateral dimension to the vertical dimension. The depressed structure with slots allows the probe body to compress vertically along its length, eliminating lateral displacement that would cause adjacent probes to contact each other, while still providing necessary vertical displacement for stress relief.
3Object-affected harmful factors
If a vertical probe with depressed structure and slots is used to enable fine pitch arrangement and prevent probe contact, then short circuits between adjacent probes are avoided, but the probe body experiences stress concentration that may generate metal fatigue
Solution Approach 1:
The invention divides the probe body into multiple segments by introducing slots. These slots create discrete deformation zones that distribute the stress more evenly throughout the probe structure. The segmented design allows controlled localized bending at slot locations, preventing excessive stress concentration at single points and reducing metal fatigue.
Solution Approach 2:
The invention modifies the mechanical parameters of the probe body by introducing geometric features (slots and depressed structures) that change the stress distribution characteristics. The slots alter the moment of inertia and stress concentration factors, enabling the probe to undergo repeated compression cycles with reduced fatigue accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables testing of high-density pad integrated circuit devices without short circuits or collisions, maintaining planarity and minimizing deformation of the bottom guide plate under increased probe force.
Implementation Method 1
a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body... configured to provide vertical displacement to relieve the stress generated as the probe contacts the device under test
Data Source
AI summary
A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body.