Vertical Probe Interface Assembly Depth Adjustment
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Solution Overview
Problem
The miniaturization of semiconductor device pads poses challenges for traditional cantilever probes, which can damage the device, and vertical probes are difficult to interface with tester equipment due to tight pitch requirements and limited depth in legacy test systems.
Innovation Solution
An interface assembly for vertical probe contactors, comprising a base board, mounting board, and depth adjust plate, with conductive surfaces of different pitches to accommodate the vertical probe tips, allowing for precise alignment and contact, and a method for manufacturing and integrating this assembly with automated testers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional cantilever probes are used to contact smaller pads, then the probe can reach the pad, but the scrubbing action may extend into the die area causing damage to the device
Solution Approach 1:
The patent inverts the traditional probing approach by using vertical probes instead of cantilever probes. The vertical probe contacts the pad from above in a perpendicular manner, eliminating the lateral scrubbing motion that causes damage to smaller pads and die areas.
Solution Approach 2:
The patent replaces the mechanical scrubbing action of cantilever probes with a vertical contact mechanism. The vertical probe delivers contact force directly downward onto the pad, substituting the harmful lateral mechanical motion with a controlled vertical force application.
2Object-affected harmful factors
If vertical probes are used to contact smaller pads, then device damage is reduced, but interfacing with tester equipment becomes more difficult due to pitch less than 100 microns and limited depth
Solution Approach 1:
The patent segments the interface system into multiple components: a base board for structural support, a mounting board for probe attachment, and a depth adjust plate for positioning. This segmentation allows each component to be optimized independently for its specific function while working together to solve the interfacing challenges.
Solution Approach 2:
The patent adds vertical depth adjustment as a new dimension to the interface design. The depth adjust plate enables precise control of probe tip positioning in the vertical dimension, allowing the system to accommodate limited depth requirements while maintaining proper contact force and alignment for tight pitch applications.
3Length of moving object
If the depth adjust plate thickness is increased to accommodate probe depth requirements, then probe contact capability is improved, but the vertical distance control precision may be compromised
Solution Approach 1:
The depth adjust plate incorporates adjustable and reconfigurable features that allow the vertical depth to be dynamically tuned. The plate can be positioned at different heights or configured with varying thicknesses to optimize both the vertical distance accommodation and the precision of probe tip positioning for specific testing requirements.
Solution Approach 2:
The patent utilizes parameter changes in the depth adjust plate design, where the plate's effective thickness or position can be varied to control the vertical distance. By adjusting this parameter, the system achieves both sufficient probe depth accommodation and precise vertical positioning control.
Data Source
AI summary
In one embodiment, the present invention includes an interface assembly for a vertical probe contactor. The interface assembly comprises a base board, a mounting board, a depth adjust plate, and an interface apparatus. The depth adjust plate is between the base board and the mounting board, and the interface apparatus is mounted to the mounting board. The interface apparatus is configured to receive the vertical probe contactor through an opening in the base board and a corresponding opening in the depth adjust plate. A thickness of the depth adjust plate defines a vertical distance between a wafer side of the base board and a plurality of probe tips of the vertical probe contactor.