Vertical Probe Local Quality Design for Small Contact Probing

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Solution Overview

Problem

Conventional vertical probes face challenges in maintaining sufficient current-withstanding capacity and structural strength while being able to probe small conductive contacts, due to the reduction in width and thickness which increases resistance and reduces strength.

Innovation Solution

The vertical probe design includes a body with a relatively larger width and thickness, and a tip portion with a reduced width and thickness only at the tip contact section, achieved through micro-electromechanical systems processing or laser cutting, to maintain structural integrity and current capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the width and thickness of the entire probe are reduced to enable probing of small conductive contacts, then the probe can access smaller contacts, but the resistance increases and structural strength decreases

Engineering Contradiction:

Improveprobe width and thicknessVSAvoidstructural strength

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The probe applies local quality by having different dimensions at different locations: the tip portion has reduced width and thickness for accessing small conductive contacts, while the body portion maintains larger width and thickness for structural strength and current capacity. This spatial variation in dimensions resolves the contradiction between probe size and strength.

Inventive Principle:

Principle #3Local quality

2Length of moving object

If the width and thickness of the entire probe are reduced to enable probing of small conductive contacts, then the probe can access smaller contacts, but the current-withstanding capacity decreases

Engineering Contradiction:

Improveprobe width and thicknessVSAvoidcurrent-withstanding capacity

Core Design Contradiction:

Length of moving objectVSPower

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

3Length of moving object

If mechanical processing or etching is used to reduce the thickness of the tip portion, then the tip can be thinned, but non-compliant tolerances occur and production yield decreases

Engineering Contradiction:

Improvetip thicknessVSAvoidtolerance compliance

Core Design Contradiction:

Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical processing or etching with laser processing to reduce the thickness of the tip portion. Laser processing provides superior dimensional control and tolerance compliance, eliminating the manufacturing precision issues associated with mechanical or chemical methods while achieving the same thickness reduction.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables the vertical probe to effectively probe small conductive contacts with improved current-withstanding capacity, structural strength, and durability, while minimizing the risk of fracture and misalignment during testing.

Implementation Method 1

processing the top surface of the substrate between a first position and a second position by the laser processing to form a transition surface that gradually approaches the bottom surface from the first position to the second position

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentUS20250138050A1Vertical probe, probe head and method of making the vertical probe

Publication Date: 2025.05.01 MPI CORP

AI summary

A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing. The vertical probe can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy. When applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.