Vertical Probe Testing Head Segmented Conductive Planes
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Solution Overview
Problem
Existing testing heads for semiconductor devices suffer from interference and noise due to ground and power contact elements, which limit frequency performance and can cause ground loops, especially when dealing with multiple power supplies.
Innovation Solution
A testing head with guides featuring multiple conductive layers that electrically connect groups of contact elements carrying the same type of signal, forming common conductive planes to reduce interference and noise, while preventing unwanted short-circuits through non-conductive zones and dielectric coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground and power contact elements are used in the testing head, then reliable electrical connection and current handling are improved, but interference and noise increase, degrading frequency performance
Solution Approach 1:
The contact elements are segmented into separate groups: ground contact elements, power contact elements, and signal contact elements. Each group is electrically connected through its own dedicated conductive layer, preventing interference between different signal types while maintaining reliable electrical connections for each function.
Solution Approach 2:
Dielectric coatings and non-conductive zones act as intermediaries between different conductive layers, allowing electrical isolation while maintaining mechanical proximity. This enables reliable current handling through multiple contact elements without direct electrical interference between ground, power, and signal paths.
2Power
If multiple contact elements are used to handle ground and power signals, then current handling capability is improved, but ground loops are generated, causing noise and interference
Solution Approach 1:
The conductive layers are segmented to provide separate electrical paths for ground and power signals. Each conductive layer connects only its designated contact elements, preventing the formation of ground loops while maintaining high current handling capability through parallel contact elements.
Solution Approach 2:
Within each conductive layer, all connected contact elements are maintained at the same electrical potential (equipotential). This eliminates voltage differences between parallel ground or power contacts, preventing ground loops while preserving current distribution capabilities.
3Reliability
If contact probes are pressed against contact pads, then good electrical contact is ensured, but bending and deformation of probes occur, affecting precision
Solution Approach 1:
The mechanical pressing function is segmented across multiple contact probes distributed in groups. Each probe carries a portion of the contact load, distributing the mechanical stress and reducing individual probe deformation while maintaining overall contact quality through the group action.
Solution Approach 2:
The mechanical properties of contact probes are optimized by selecting materials and dimensions that provide appropriate flexibility for pressing contact while maintaining alignment precision. The guide holes and support structures are designed with parameters that constrain probe movement to acceptable tolerances during pressing operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces noise and interference, enhancing frequency performance and allowing for effective electric connection between contact pads without compromising the testing head's frequency capabilities, while preventing unnecessary short-circuits and improving current handling.
Implementation Method 1
each of said conductive layers including the holes of a respective group of guide holes and electrically connecting a corresponding group of contact elements housed in the group of guide holes
Implementation Method 2
A testing head with guides featuring multiple conductive layers that electrically connect groups of contact elements carrying the same type of signal, forming common conductive planes to reduce interference and noise
Implementation Method 3
preventing unwanted short-circuits through non-conductive zones and dielectric coatings
Data Source
AI summary
A testing head comprises at least one guide provided with a plurality of guide holes, and a plurality of contact elements housed in the plurality of guide holes. Suitably, the at least one guide comprises a plurality of conductive layers, each conductive layer: including holes of a corresponding plurality of group of the plurality of guide holes and electrically connecting a corresponding group of contact elements housed in the guide holes of the group, contact elements of a group being adapted to carry a same type of signal. The at least one guide is a multilayer comprising a plurality of non-conductive layers, and the conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers.