Vertical Voltage Regulator Assembly for Low-Impedance Die Power
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Modern computing systems face challenges in providing efficient and rapid voltage regulation to integrated circuit dies due to physical distance and impedance between voltage regulators and the integrated circuit die, particularly in high-performance systems with multiple processor cores and varying power demands, leading to voltage droops and inefficiencies.
Innovation Solution
A vertically integrated voltage regulator assembly is positioned physically near the integrated circuit die, with inductors and voltage regulation circuits mounted on a substrate opposite the die, reducing impedance and enabling rapid response to power demand changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If voltage regulator circuitry is positioned far from the integrated circuit die, then ease of manufacture and device simplicity are improved, but voltage droop and response time worsen due to physical distance and impedance
Solution Approach 1:
The patent transitions from a planar arrangement where the voltage regulator is positioned laterally adjacent to the integrated circuit die to a vertical arrangement where the voltage regulator is positioned above or below the die along the vertical dimension. This dimensional change allows the regulator to be physically closer to the die, reducing trace length and impedance, while maintaining ease of manufacture through standardized vertical stacking techniques in multi-chip module fabrication.
2Reliability
If voltage regulator is placed close to integrated circuit die, then voltage droop and response time are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the voltage regulator circuitry with the integrated circuit die assembly by positioning the regulator in close proximity and integrating the power delivery path. This merging reduces the complexity of external power delivery networks, minimizes the number of external components required, and simplifies the overall device architecture while achieving low-impedance power delivery.
3Speed
If physical distance between voltage regulator and integrated circuit die is reduced, then voltage droop is reduced and response speed is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the power delivery system into distinct functional modules: the integrated circuit die, the voltage regulator module, and the interconnecting power delivery network. This segmentation allows each module to be optimized and manufactured separately with standard precision requirements, then assembled together using established multi-chip module techniques, avoiding the need for ultra-precise single-step manufacturing.
Data Source
AI summary
An integrated circuit assembly comprises an integrated circuit die and a substrate electrically and physically coupled to the integrated circuit die on a first mounting surface of the substrate. A vertically integrated voltage regulator assembly comprises one or more inductors and one or more voltage regulation circuits, and is electrically and physically connected to the substrate at a physical location on a second mounting surface of the substrate opposite the first mounting surface of the substrate. At least a portion of the vertically integrated voltage regulator assembly and at least a portion of the integrated circuit die are intersected by an axis normal to and through first and second mounting surfaces. An array of electrical connections are coupled to the substrate and electrically connected to the integrated circuit die, the array of electrical connections operable to electrically connect the substrate to a printed circuit board and/or to a socket.