Vertical Voltage Regulator PCB Cutout Layout for Low-Impedance Power Delivery
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Solution Overview
Problem
Modern computing systems face challenges in efficiently providing voltage regulation to integrated circuit dies due to physical distance and impedance between voltage regulators and the integrated circuit die, leading to voltage droops and inefficiencies in power delivery, particularly in high-performance systems with multiple processor cores and cache memory.
Innovation Solution
A vertically integrated voltage regulator assembly is positioned near the integrated circuit die by incorporating a hole or cutout in the printed circuit board, reducing impedance and enabling rapid response to changes in power demand, with components like inductors and voltage regulation circuits mounted on a substrate opposite the die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If voltage regulator is positioned remotely on circuit board, then device layout flexibility is improved, but impedance and physical distance increase causing voltage droop
Solution Approach 1:
The voltage regulator is nested within a cutout in the circuit board, allowing it to be positioned close to the integrated circuit die while maintaining board layout flexibility. The regulator assembly is inserted into the cutout space, effectively nesting it within the board structure rather than requiring separate mounting space.
Solution Approach 2:
The voltage regulator is positioned in a different spatial dimension relative to the circuit board surface - specifically within a cutout that extends through the board thickness. This allows the regulator to be close to the die in the vertical dimension while maintaining horizontal layout flexibility.
2Reliability
If voltage regulator is positioned close to integrated circuit die, then impedance and response time are improved, but circuit board design complexity increases
Solution Approach 1:
The voltage regulator is extracted from the traditional surface-mounted position and relocated into a cutout in the circuit board. This extraction allows the regulator to be positioned close to the integrated circuit die, reducing impedance and improving response time while containing the added complexity within a localized feature.
3Reliability
If high current capability is provided to reduce voltage droop, then power delivery reliability is improved, but regulator response speed decreases due to physical distance and impedance
Solution Approach 1:
By nesting the voltage regulator within a cutout in the circuit board, the design achieves both high current capability and fast response speed. The regulator is positioned close to the integrated circuit die, minimizing the length of current paths and reducing impedance, which allows the regulator to respond quickly to load changes while maintaining the ability to deliver high current.
Data Source
AI summary
An integrated circuit assembly comprises an integrated circuit die and a substrate coupled to the integrated circuit die on a first mounting surface of the substrate. A printed circuit board has a hole formed therein, and is connected to the substrate connected on a second mounting surface of the substrate. A vertically integrated voltage regulator assembly comprises one or more inductors and one or more voltage regulation circuits, and is connected to the substrate at a physical location on a second mounting surface of the substrate opposite the first mounting surface of the substrate. At least a portion of the vertically integrated voltage regulator assembly and at least a portion of the substrate are intersected by an axis normal to and through the first and second mounting surfaces of the substrate, and the vertically integrated voltage regulator is disposed at least partially within the hole in the printed circuit board.