Vertical Ring Connector Interconnect for Optical Transceiver Cooling
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Solution Overview
Problem
Optical transceivers face performance degradation due to elevated temperatures, with VCSELs and photodiodes being adversely affected, and conventional designs limit heat dissipation and design options for integrating optical transceivers into communication systems.
Innovation Solution
A low-profile interconnect module with a rectangular substrate and a ring connector system that includes a vertical insertion mechanism, latches, and a heat spreader to manage heat dissipation, along with a ferrule mate and optical block for efficient optical-to-electrical conversion, allowing for high data rate transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If VCSELs and photodiodes are operated at elevated temperatures, then the operating temperature range is extended, but light source performance and electrical-to-optical conversion efficiency are degraded
Solution Approach 1:
The patent divides the heat management function into separate components: heat spreaders attached to VCSELs and photodiodes, thermal vias in the substrate, and external heat sinks. This segmentation allows each component to address specific heat generation points, effectively managing temperature without compromising device performance at elevated operating temperatures.
Solution Approach 2:
The patent introduces thermal interface materials and heat spreaders as intermediary components between the heat-generating optoelectronic devices and the substrate/heat sinks. These intermediaries facilitate efficient heat transfer while electrically isolating or mechanically supporting the devices, enabling operation at higher temperatures without direct thermal damage.
2Ease of manufacture
If conventional transceiver designs are used, then manufacturing and integration are simplified, but heat dissipation is limited and design options are restricted
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional thermal management by attaching heat spreaders to the top surfaces of VCSELs and photodiodes, using vertical thermal vias through the substrate, and positioning external heat sinks above the substrate. This dimensional approach significantly increases heat dissipation capacity while maintaining compact integration.
Solution Approach 2:
The patent employs composite thermal management structures combining different materials: metal heat spreaders with high thermal conductivity, substrate materials with tailored thermal properties, and thermal interface materials. This composite approach optimizes heat transfer pathways while maintaining electrical and mechanical functionality.
3Adaptability or versatility
If optical transceivers are integrated into communication systems, then system functionality is achieved, but thermal management and design flexibility are constrained
Solution Approach 1:
The patent designs the substrate to serve multiple functions: electrical interconnection of components, mechanical support, optical signal routing, and thermal management through integrated thermal vias and heat spreader mounting. This multi-functionality reduces the need for separate dedicated thermal management components, simplifying overall system integration while maintaining design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat management and a compact design that maintains optical transceiver performance at elevated temperatures, enabling high-speed data transmission with a reduced footprint and improved reliability.
Implementation Method 1
The light source is typically a laser light source, such as a VCSEL (Vertical Cavity Surface Emitting Laser)
Implementation Method 2
The optical receiver typically includes one or more photodetectors that receive optical input signals and convert the optical input signals to electrical output signals
Implementation Method 3
A low-profile interconnect module with a rectangular substrate and a ring connector system that includes a vertical insertion mechanism, latches, and a heat spreader to manage heat dissipation
Data Source
AI summary
An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint The interconnection system is capable of transferring information at high data rates.