Vertical Ring Connector Interconnect for High-Speed Thermal Control
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Solution Overview
Problem
Optical transceivers face performance degradation due to elevated temperatures, with VCSELs and photodiodes being adversely affected, and conventional designs limit heat dissipation and design options for integrating optical transceivers into communication systems.
Innovation Solution
A low-profile interconnect module with a vertical insertion system and ring connector, featuring a rectangular substrate, electrical contacts, and a ferrule mate with focusing and collimating lenses, along with a heat spreader to manage heat, and a latch system for secure attachment, enabling high-speed data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If VCSELs and photodiodes are operated at elevated temperatures, then the operating temperature range is extended, but light source performance and electrical-to-optical conversion efficiency are degraded
Solution Approach 1:
The patent extracts the heat-generating IC components from the thermal environment of the VCSELs and photodiodes by providing dedicated heat dissipation paths through the substrate and housing. This separates the thermal management of high-power ICs from the temperature-sensitive optical components, allowing the optical components to operate at lower temperatures while the ICs can operate at higher temperatures.
Solution Approach 2:
The patent introduces thermal management intermediaries including a heat spreader layer, thermally conductive substrate material, and heat dissipation fins that act as intermediaries between the heat-generating ICs and the housing. These intermediaries conduct heat away from the optical components while allowing the ICs to operate at elevated temperatures.
2Ease of manufacture
If conventional horizontal insertion designs are used, then manufacturing and integration are simplified, but heat dissipation capability and design flexibility are limited
Solution Approach 1:
The patent inverts the conventional horizontal insertion design by implementing vertical insertion architecture. The optical engine is positioned vertically above the substrate with optical fibers extending downward, and the housing is oriented vertically. This inversion enables superior heat dissipation through the vertical path while maintaining ease of manufacturing through standardized vertical mounting processes.
Solution Approach 2:
The patent transitions from two-dimensional horizontal layout to three-dimensional vertical architecture. The optical engine is positioned in the vertical dimension above the substrate, with heat dissipation occurring through the vertical path via heat spreader and fins. This dimensional change enables improved thermal management without compromising manufacturing simplicity.
3Temperature
If larger heat dissipation systems are implemented, then thermal management is improved, but device footprint and profile height increase
Solution Approach 1:
The patent implements nesting by integrating the heat spreader layer within the substrate structure and positioning the heat dissipation fins within the housing cavity. The optical engine is nested vertically above the substrate, and the ferrule mate is positioned within the housing. This nested arrangement maximizes heat dissipation surface area while minimizing the overall device footprint and profile height.
Solution Approach 2:
The patent uses thin-film heat spreader layers with high thermal conductivity that can be integrated into the substrate. These thin films provide effective heat dissipation without adding significant thickness or volume to the device, enabling efficient thermal management within compact form factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat and maintains performance at elevated temperatures, allowing for high-speed data transmission with a compact footprint and improved design flexibility.
Implementation Method 1
The light source is typically a laser light source, such as a VCSEL (Vertical Cavity Surface Emitting Laser) or some other type of laser
Implementation Method 2
The optical receiver typically includes one or more photodetectors that receive optical input signals and convert the optical input signals to electrical signals
Implementation Method 3
The interconnect module can include a heat spreader that defines a heat spreader cavity
Data Source
AI summary
An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.