Vertical Ring Inductor Structure for Chip Area Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Spiral-shaped and 8-shaped inductors are limited by chip area and are costly, with significant quality factor degradation due to coupling with the substrate.
Innovation Solution
An inductor structure comprising first and second curve metal components and a connection component, where the components are disposed on perpendicular planes, forming a ring-shaped inductor that occupies less area and has a higher quality factor, with optional switches for inductance adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If spiral-shaped or 8-shaped inductors are used, then inductance function is achieved, but chip area is excessively occupied
Solution Approach 1:
The patent transitions the inductor structure from a planar configuration to a three-dimensional configuration by standing the inductor on its side. The inductor body is positioned vertically relative to the chip surface, with terminals extending upward, thereby utilizing the vertical dimension to reduce planar area occupation while maintaining inductance functionality.
Solution Approach 2:
The inductor structure is divided into distinct segments: a base portion attached to the chip surface, a vertical inductor body extending upward, and terminal portions at the top. This segmentation allows the inductor to occupy minimal chip area while maintaining its electrical function through the vertical arrangement of components.
2Area of stationary object
If inductors are placed close to substrate, then area is reduced, but coupling with substrate occurs causing quality factor degradation
Solution Approach 1:
By elevating the inductor body vertically from the chip surface, the patent creates spatial separation between the inductor and the substrate. This vertical positioning reduces parasitic coupling effects between the inductor and substrate while maintaining a compact planar footprint, thereby improving quality factor without sacrificing area efficiency.
3Ease of manufacture
If traditional planar inductor designs are used, then manufacturing is simple, but area occupancy is high
Solution Approach 1:
The patent maintains manufacturing simplicity by using standard semiconductor fabrication processes to create the vertical inductor structure. The inductor is formed as an integrated three-dimensional structure during chip fabrication, eliminating the need for complex post-processing or assembly steps while achieving reduced area occupancy through vertical configuration.
Data Source
AI summary
An inductor structure includes a first curve metal component, a second curve metal component, a connection component, and a capacitor. The first and the second curve metal components are disposed on a layer. The layer is located at a first plane, the first and the second curve metal components are located at a second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the connection component is coupled to a first terminal of the first curve metal component. A second terminal of the connection component is coupled to a first terminal of the second curve metal component. A first terminal of the capacitor is coupled to a second terminal of the first curve metal component. A second terminal of the capacitor is coupled to a second terminal of the second curve metal component.