Vertical Sensor Stack for Grain Layer Thickness
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Solution Overview
Problem
Current monitoring devices in combine harvesters are unable to accurately measure the thickness of grain and residue layers as they segregate during the cleaning process, limiting the optimization of crop throughput and being crop-specific.
Innovation Solution
A sensor arrangement with vertically stacked sensor elements mounted on the grain pan or sieves, capable of measuring electrical properties to detect layer thickness and segregation, regardless of crop type, by distinguishing between grain and residue layers through independent readout of sensor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single capacitive sensor is mounted upright on the grain pan surface, then the flow rate of grain/residue mixture can be measured, but the sensor cannot detect segregated grain and residue layers
Solution Approach 1:
The sensor is divided into multiple sensor elements arranged in a vertical stack, where each element can independently detect the presence and thickness of different layers (grain and residue) separately. This segmentation allows the sensor to resolve segregated layers that a single sensor cannot detect.
Solution Approach 2:
The sensor elements are arranged vertically in a stack configuration, adding a vertical dimension to the measurement. This allows detection of layer thickness and segregation in the vertical direction, transforming a single-point measurement into a multi-level spatial measurement that captures layer structure.
2Measurement precision
If monitoring devices are designed for specific crop types, then measurement accuracy for that crop is improved, but the device cannot be used for other crop types
Solution Approach 1:
The sensor design with multiple vertically stacked elements creates a universal measurement device that can detect different crop types and their segregated layers. The same sensor configuration works for various crops without requiring redesign, as the vertical stack captures the general structure of segregated layers regardless of specific crop characteristics.
3Productivity
If the harvester size is increased to improve throughput, then crop processing capacity increases, but the vehicle size approaches a realistically workable limit
Solution Approach 1:
The sensor provides real-time feedback on layer thickness and segregation of grain and residue during the cleaning process. This feedback enables dynamic adjustment of cleaning parameters to optimize throughput without requiring larger harvester dimensions, as the system can be fine-tuned based on actual material flow conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise measurement of layer thickness and segregation, improving crop throughput monitoring and adaptability across different crops, enhancing the efficiency of the cleaning process in combine harvesters.
Implementation Method 1
a capacitive sensor is used for measuring the flow of grain on a grain pan. The sensor is mounted upright on the surface of a grain pan and comprises two comb-shaped electrodes engaged with each other and mounted parallel or perpendicular to the flow direction. Measurement of the electrostatic capacitance between the two electrodes allows the determination of the flow rate of a grain/residue mixture on the grain pan.
Data Source
Figure 1
Figure 2~3
Figure 4a~4b
AI summary
The present invention is related to a sensor (20) for measuring the thickness of a layer (19) of a grain/residue mixture as the layer is transported through the cleaning arrangement of a combine harvester. The sensor is preferably mounted on the support surface of a grain pan or a sieve of the cleaning arrangement and comprises a tower-shaped support structure (21) with sensor elements (22) attached to the structure and forming a vertical stack of sensor elements, so that a number of sensor elements is submerged in the advancing layer (19) and a number of sensor elements extend above the layer. The sensor elements are configured to measure an electrical property that changes as a function of the immediate surroundings of the sensor element. The sensor elements (22) are configured to be read out independently from each other.