Vertical Side-Surface Deposition for Through-Hole-Free Substrates
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Solution Overview
Problem
Existing deposition techniques struggle to efficiently form complex conductive patterns on substrates, particularly in vertical orientations, leading to unreliable electrical connections and the need for through-holes in the substrate.
Innovation Solution
A deposition apparatus and method that supports substrates in a vertical orientation, using multiple printing devices to deposit conductive patterns and resist masks on the side surfaces, enabling electrical connections between main surfaces without through-holes, utilizing screen printing and orientation-changing devices for efficient pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional deposition techniques are used on horizontal substrates, then the deposition process is simple, but the electrical connections are unreliable and require through-holes
Solution Approach 1:
The patent inverts the conventional horizontal substrate deposition approach by using vertical substrate deposition. The deposition device deposits conductive material on the side surface of the substrate while the substrate is held vertically, allowing gravity to assist material flow and ensuring complete coverage without requiring through-holes for electrical connections.
Solution Approach 2:
The patent transitions from two-dimensional deposition on horizontal surfaces to three-dimensional deposition on vertical side surfaces. This dimensional change allows conductive material to be deposited on the lateral surface of the substrate, creating electrical connections between top and bottom surfaces without penetrating through the substrate thickness.
2Reliability
If multiple printing devices are used to deposit conductive patterns on side surfaces, then the adhesion and stability of electrical connections are enhanced, but the device complexity increases
Solution Approach 1:
The deposition apparatus is segmented into multiple printing devices, each responsible for depositing conductive material on specific regions of the substrate side surface. This segmentation allows for precise control of material deposition in different areas, ensuring optimal adhesion and electrical connection stability while maintaining manageable system complexity through modular design.
Solution Approach 2:
The multiple printing devices are designed with universal functionality to deposit conductive material on various orientations and surfaces of the substrate. Each printing device can adapt to different deposition requirements, making the system versatile for creating complex conductive patterns while avoiding the need for specialized equipment for each function.
3Manufacturing precision
If substrates are held in vertical orientation during deposition, then the deposition of thick conductive patterns is facilitated, but the substrate handling complexity increases
Solution Approach 1:
The substrate holding device creates an equipotential vertical orientation during deposition, where gravity acts uniformly on the substrate and deposited material. This vertical positioning ensures that thick conductive patterns can be deposited without material running off or pooling unevenly, as the gravitational force is perpendicular to the deposition surface, simplifying the handling of thick material layers.
4Stability of the object's composition
If through-holes are avoided in substrate, then the substrate integrity is maintained, but the electrical connection formation becomes more difficult
Solution Approach 1:
The patent extracts the electrical connection formation process from the traditional through-hole approach. Instead of creating holes through the substrate and filling them with conductive material, the invention extracts the connection path and forms it along the side surface of the substrate, maintaining substrate integrity while achieving the same electrical connectivity function through a different geometric path.
Data Source
AI summary
A deposition apparatus includes a first substrate support for supporting a substrate in a substantially vertical orientation. The substrate has a first main surface, a second main surface opposite the first main surface and a side surface between the first main surface and the second main surface. The deposition apparatus includes a first deposition device for depositing a first conductive pattern or a first resist mask on the side surface of the substrate while the substrate is supported in the substantially vertical orientation by the first substrate support.