Vertical SMD Dipole Mounting for Space-Saving Substrates
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Solution Overview
Problem
Conventional surface-mount devices (SMDs) on base substrates occupy significant surface area and complicate metal connection routing, limiting space and increasing connection length.
Innovation Solution
Housing SMDs in holes perpendicular to the substrate faces, using conductive adhesive to connect terminations with internal metal levels, allowing for reduced surface occupation and efficient electrical connections without altering the substrate's structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If surface-mount devices are mounted on the surface of the base substrate, then electrical connections can be established, but the space occupied on the substrate surface increases
Solution Approach 1:
The patent transitions from mounting surface-mount devices on the two-dimensional surface of the substrate to mounting them on the three-dimensional side surface of the substrate. This dimensional change allows devices to be positioned vertically along the edges, effectively utilizing the substrate's lateral surface area rather than competing for top surface real estate, thereby reducing the area occupied on the substrate surface while maintaining manufacturing feasibility
2Length of stationary object
If surface-mount devices are mounted on the substrate surface, then components can be electrically connected, but the length of metal connections increases
Solution Approach 1:
By positioning surface-mount devices on the side surface of the substrate rather than the top surface, the patent creates shorter vertical and lateral metal connection paths. The devices are positioned closer to the substrate's internal circuitry in the vertical dimension, reducing the overall length of metal traces required to establish electrical connections while minimizing the surface area consumed on the substrate top
3Productivity
If surface-mount devices are mounted on the substrate surface, then assembly can be performed, but the spatial requirement on the substrate surface increases
Solution Approach 1:
The patent utilizes the substrate's side surface as an additional mounting dimension, allowing surface-mount devices to be positioned vertically along the edges. This approach maintains assembly efficiency by using standard surface-mount technology processes while dramatically reducing the competition for top surface space, enabling higher component density on the substrate top for other critical components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces substrate surface space requirements and simplifies electrical connections by vertically integrating SMDs, maintaining mechanical and electrical integrity while minimizing structural modifications.
Implementation Method 1
a first volume of conductive adhesive on one of the terminations thereof for electrically connecting said termination to at least one metal level of the interconnection grid of the base substrate
Data Source
AI summary
A base substrate has a thickness between two faces. The base substrate includes at least one hole extending in a thickness of the base substrate perpendicular to one of the two faces. At least one dipole of a surface-mount device type is housed in the at least one hole of the base substrate.