Vertical-Coupled SSPP Transmission Line for Compact PCB Layouts
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Solution Overview
Problem
Existing microwave transmission line structures, such as coplanar waveguides, occupy large space and are not conducive to compact integrated designs due to their width being several times that of spoof surface plasmon polariton (SSPP) transmission lines, hindering miniaturization of devices.
Innovation Solution
A SSPP transmission line structure with metal strips laminated vertically on dielectric substrates, where energy is coupled from one strip to another, reducing the width and forming a single-layer metal structure, using etching processes for manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coplanar waveguide or conventional transmission line structures are used to connect SSPP transmission line, then signal transmission is achieved, but occupied circuit space increases significantly
Solution Approach 1:
The patent transitions from horizontal energy coupling in coplanar waveguides to vertical energy coupling by stacking metal strips on different layers of dielectric substrates. This dimensional change from 2D planar to 3D stacked structure enables compact integration while maintaining signal transmission functionality.
Solution Approach 2:
The patent employs multiple metal strips nested vertically on different layers, where each metal strip is coupled to adjacent strips through dielectric substrates. This nested multi-layer structure allows efficient energy coupling in vertical direction, reducing the horizontal footprint while maintaining transmission performance.
2Ease of manufacture
If conventional transmission line conversion structures are used, then connection to SSPP transmission line is achieved, but device integration density decreases
Solution Approach 1:
The invention uses vertical stacking of metal strips on multiple layers to achieve compact connection structures. This reduces the horizontal space required for conversions and interfaces, thereby improving integration density while maintaining manufacturability through standard multi-layer PCB processes.
Solution Approach 2:
The patent combines multiple functional elements (signal transmission, energy coupling, and impedance transformation) into a single integrated multi-layer structure. This merging of functions reduces the number of separate components and simplifies the overall device architecture, improving integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vertical coupling reduces the width of the SSPP transmission line, saving circuit space and enabling more compact device designs while maintaining signal transmission quality.
Implementation Method 1
the first metal strip and the second metal strip are spatially laminated, to finally concentrate the signal energy onto the second metal strip
Data Source
AI summary
This application provides a spoof surface plasmon polariton transmission line structure, a circuit board, and an electronic device, to reduce a size of the SSPP transmission line structure. The SSPP transmission line structure includes a first dielectric substrate, a first metal strip, and a second metal strip. The first metal strip and the second metal strip are respectively disposed on two opposite surfaces of the first dielectric substrate, the first metal strip and the second metal strip separately extend in a first direction, and a length of the first metal strip in the first direction is less than a length of the second metal strip in the first direction. In the first direction, a cross-sectional area of the first metal strip gradually decreases, and at least one side of the second metal strip has a plurality of protrusion parts spaced apart.