Vertical SST Buried Contacts for Simpler LED Packaging
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Solution Overview
Problem
Conventional vertical LED devices face challenges with heat management, delamination, and increased complexity due to the need for access to both sides of the die for electrical connections, which complicates packaging and increases manufacturing costs.
Innovation Solution
The development of vertical high voltage solid-state transducers with buried contacts and associated systems and methods, which allow for the formation of SST dies with trenches separating individual junctions and buried contact elements extending from one side of the die to the other, enabling efficient electrical connections and reduced complexity in packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If vertical LED devices are used with conventional contact configurations, then light output and electrical connection are achieved, but heat management deteriorates and delamination occurs
Solution Approach 1:
The patent transitions from lateral contact configuration to vertical contact configuration, changing the spatial dimension of electrical connections. This dimensional change allows heat to be conducted vertically through the substrate rather than laterally, improving thermal management while maintaining light output.
Solution Approach 2:
The patent introduces a substrate as an intermediary element between the LED structure and the external environment. This substrate serves dual functions: providing mechanical support and acting as a heat sink to conduct away generated heat, preventing delamination.
2Reliability
If access to both sides of the die is required for electrical connections, then electrical connectivity is achieved, but packaging complexity increases
Solution Approach 1:
The patent merges the functions of electrical connection and heat dissipation into a single vertical contact structure. By combining these functions, the number of required access points is reduced from two (both sides of the die) to one (bottom side only), simplifying packaging while maintaining electrical reliability.
Solution Approach 2:
The patent inverts the conventional approach by placing the electrical contact on the bottom side of the device rather than on the top side. This inversion allows the light-emitting surface to remain exposed while the contact is made through the substrate from below, reducing packaging complexity.
3Reliability
If conventional contact configurations are used, then electrical connection is achieved, but manufacturing costs increase
Solution Approach 1:
The patent extracts the electrical contact function from the top surface of the LED and relocates it to the bottom surface through the substrate. This extraction eliminates the need for complex wire bonding or flip-chip techniques, reducing manufacturing steps and costs while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency and reliability of vertical LED devices by improving current spreading, light extraction, and thermal management, while simplifying the packaging process and reducing manufacturing costs.
Implementation Method 1
Solid-state devices, such as LEDs, convert electrical energy to light by applying a bias across oppositely doped materials to generate light from an intervening active region of semiconductor material.
Data Source
AI summary
Solid-state transducers (“SSTs”) and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side of the transducer structure. The SST can further include a plurality of first contacts at the first side and electrically coupled to the first semiconductor material, and a plurality of second contacts extending from the first side to the second semiconductor material and electrically coupled to the second semiconductor material. An interconnect can be formed between at least one first contact and one second contact. The interconnects can be covered with a plurality of package materials.