Vertical Stacked Semiconductor Module with Insulated Metal Plates
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Solution Overview
Problem
Conventional semiconductor modules require a large area for mounting circuit elements and suffer from low reliability due to wire bonding, which increases the area needed and introduces thermal expansion issues.
Innovation Solution
A semiconductor module configuration with metal plates stacked vertically, where switching and circuit elements are bonded between plates in a vertical direction, using an insulating material to reduce area requirements and enhance reliability by minimizing thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If circuit elements are mounted on the substrate in a horizontal direction, then the mounting area is sufficient for the circuit elements, but the area for mounting the circuit element increases and wire bonding reliability decreases
Solution Approach 1:
The patent transitions from horizontal mounting to vertical stacking configuration. Circuit elements are mounted vertically between metal plates in the stacking direction, changing the spatial arrangement from 2D horizontal layout to 3D vertical integration. This dimensional change reduces the footprint area while maintaining sufficient mounting space for circuit elements.
Solution Approach 2:
The patent implements nested arrangement where circuit elements are positioned between metal plates in the stacking direction. The capacitor element is nested within the vertical space between the first and second metal plates, utilizing the stacking dimension to reduce overall device footprint while maintaining component functionality.
2Reliability
If circuit elements are mounted on the substrate in a horizontal direction, then the mounting process is simple, but warping occurs due to thermal expansion coefficient differences
Solution Approach 1:
The patent addresses warping by transitioning to vertical stacking configuration. The circuit elements are arranged vertically between metal plates rather than horizontally on the substrate surface. This dimensional change distributes thermal stress differently, reducing warping caused by thermal expansion coefficient differences between the substrate and circuit elements.
Solution Approach 2:
The patent changes the spatial arrangement parameter from horizontal to vertical orientation. This parameter change in mounting configuration alters the thermal stress distribution pattern, thereby reducing warping effects caused by differential thermal expansion between the substrate and circuit elements during temperature variations.
3Reliability
If metal wire is used for connecting the circuit element to the substrate, then electrical connection is achieved, but the area for mounting the circuit element increases and reliability decreases
Solution Approach 1:
The patent extracts and eliminates the metal wire bonding process from the conventional horizontal mounting structure. By transitioning to vertical stacking with direct bonding between metal plates, the wire bonding step is removed entirely, eliminating its associated reliability issues and area requirements.
Solution Approach 2:
The patent merges the electrical connection function with the structural support function by directly bonding circuit elements between metal plates in the vertical stacking configuration. This integration eliminates the need for separate wire bonding, combining multiple functions into a single robust connection structure that improves reliability while reducing area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the area needed for mounting circuit elements, increases reliability, and minimizes warping due to thermal expansion differences, resulting in a more compact and reliable semiconductor module.
Implementation Method 1
an insulating material is disposed between the plurality of metal plates
Implementation Method 2
The at least one switching element is bonded between two of the plurality of metal plates
Data Source
AI summary
It is an object of the present invention to provide a semiconductor module in which a bonded portion has high reliability, and that has a small area. A semiconductor module includes a plurality of metal plates extending in a horizontal direction and stacked in a vertical direction, at least one switching element, and at least one circuit element. The at least one switching element is bonded between two of the plurality of metal plates, facing each other in a vertical direction. The at least one circuit element is bonded between two of the plurality of metal plates, facing each other in a vertical direction. Disposed between the plurality of metal plates is an insulating material. At least one of the plurality of metal plates is bonded to the at least one switching element and the at least one circuit element.